000487161 000__ 01154cam\a2200325Ia\4500
000487161 001__ 487161
000487161 005__ 20210513171337.0
000487161 006__ m\\\\\o\\d\\\\\\\\
000487161 007__ cr\cn|||||||||
000487161 008__ 081106s2009\\\\nyua\\\\ob\\\\001\0\eng\d
000487161 010__ $$z  2008047491
000487161 020__ $$z1606922661 (hardcover)
000487161 020__ $$z9781606922668 (hardcover)
000487161 020__ $$z9781616682705
000487161 035__ $$a(CaPaEBR)ebr10659144
000487161 035__ $$a(OCoLC)608692447
000487161 040__ $$aCaPaEBR$$cCaPaEBR
000487161 05014 $$aTK453$$b.R43 2009eb
000487161 08204 $$a537/.24$$223
000487161 24500 $$aRecent advances in dielectric materials$$h[electronic resource] /$$cAi Huang, editor.
000487161 260__ $$aNew York :$$bNova Science Publishers,$$cc2009.
000487161 300__ $$axiv, 792 p. :$$bill. (some col.)
000487161 504__ $$aIncludes bibliographical references and index.
000487161 506__ $$aAccess limited to authorized users.
000487161 650_0 $$aDielectrics.
000487161 650_0 $$aInterconnects (Integrated circuit technology)
000487161 7001_ $$aHuang, Ai,$$d1965-
000487161 852__ $$bebk
000487161 85640 $$3ProQuest Ebook Central Academic Complete$$uhttps://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=10659144$$zOnline Access
000487161 909CO $$ooai:library.usi.edu:487161$$pGLOBAL_SET
000487161 980__ $$aEBOOK
000487161 980__ $$aBIB
000487161 982__ $$aEbook
000487161 983__ $$aOnline