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MEMS and nanotechnology. Volume 5 : proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics [electronic resource] / Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong, editors.

Annual Conference on Experimental and Applied Mechanics (2013 : Lombard, Ill.); Shaw, Gordon, editor of compilation.
2013
TK7875
Available Online
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Title
MEMS and nanotechnology. Volume 5 : proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics [electronic resource] / Gordon Shaw III, Barton C. Prorok, LaVern Starman, Cosme Furlong, editors.
Meeting Name
Annual Conference on Experimental and Applied Mechanics (2013 : Lombard, Ill.)
ISBN
9783319007809 electronic book
3319007807 electronic book
9783319007793
DOI
https://doi.org/10.1007/978-3-319-00780-9
Published
Cham : Springer, [2013?]
Copyright
©2014
Language
English
Description
1 online resource (viii, 134 pages) : illustrations.
Item Number
10.1007/978-3-319-00780-9 doi
Call Number
TK7875
Dewey Decimal Classification
621.381
Summary
MEMS and Nanotechnology, Volume 5: Proceedings of the 2013 Annual Conference on Experimental and Applied Mechanics, the fifth volume of eight from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Microelectronics Packaging Single Atom/Molecule Mechanical Testing MEMS Devices & Fabrication In-Situ Mechanical Testing Nanoindentation Experimental Analysis of Low-Dimensional Materials for Nanotechnology
Note
International conference proceedings.
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Access limited to authorized users.
Source of Description
Description based on online resource; title from PDF title page (SpringerLink, viewed September 24, 2013).
Added Author
Shaw, Gordon, editor of compilation.
Series
Conference proceedings of the Society for Experimental Mechanics series, 2191-5644
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From the Contents: Warpage Measurement of Simulated Electronic Packaging Assembly
Nanomechanical Characterization of Lead Free Solder Joints
In-Situ Surface Mount Process Characterization Using Digital Image Correlation
Acoustic Waveform Energy as an Interconnect Damage Indicator
Shape Optimization of Cantilevered Piezoelectric Devices
Unique Fabrication Method for Novel MEMS Micro-contact Structure
A Frequency Selective Surface Design Fabricated With Tunable RF Meta-atoms
Stress Characterization in Si/SiO2 Spherical Shells Used in Micro-Robotics.

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