Design for manufacturability [electronic resource] : from 1D to 4D for 90-22nm technology nodes / Artur Balasinski.

9781461417613 electronic book
1461417619 electronic book
9781461417606

New York, New York : Springer, [2013?]

©2014

English

1 online resource.

10.1007/978-1-4614-1761-3 doi

TK7867

621.3815

This book explains integrated circuit design for manufacturability (DfM) at the product level (packaging, applications) and applies engineering DfM principles to the latest standards of product development at 22 nm technology nodes. It is a valuable guide for layout designers, packaging engineers and quality engineers, covering DfM development from 1D to 4D, involving IC design flow setup, best practices, links to manufacturing and product definition, for process technologies down to 22 nm node, and product families including memories, logic, system-on-chip and system-in-package. Provides design for manufacturability guidelines on layout techniques for the most advanced, 22 nm technology nodes; Includes information valuable to layout designers, packaging engineers and quality engineers, working on memories, logic, system-on-chip and system-in-package; Offers a highly-accessible, single-source reference to information otherwise available only from disparate sources; Helps readers to translate reliability methodology into real design flows.

Includes bibliographical references.

Access limited to authorized users.

Description based on print version record.

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