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Copper electrodeposition for nanofabrication of electronics devices [electronic resource] / Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi, editors.

Kondo, K. (Kazuo), editor of compilation.
2014
TS692.C6
Available Online
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Title
Copper electrodeposition for nanofabrication of electronics devices [electronic resource] / Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi, editors.
ISBN
9781461491767 electronic book
1461491762 electronic book
9781461491750
DOI
https://doi.org/10.1007/978-1-4614-9176-7
Published
New York : Springer, 2014.
Language
English
Description
1 online resource (viii, 282 pages) : illustrations (some color).
Item Number
10.1007/978-1-4614-9176-7 doi
Call Number
TS692.C6
Dewey Decimal Classification
671.7323
Summary
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: ULSI wiring material based upon copper nanowiring ; Printed circuit boards ; Stacked semiconductors ; Through Silicon Via ; Smooth copper foil for Lithium-Ion battery electrodes This book is ideal for nanotechnologists, industry professionals, and practitioners.
Access Note
Access limited to authorized users.
Source of Description
Description based on online resource; title from PDF title page (SpringerLink, viewed November 25, 2013).
Added Author
Kondo, K. (Kazuo), editor of compilation.
Series
Nanostructure science and technology ; v.171. 1571-5744
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All Resources
Copper Electrodeposition
Suppression Effect and Additive Chemistry
Acceleration Effect
Modeling and Simulation
Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects
Microstructure of Evolution of Copper in Nano-scale Interconnect Features
Direct Copper Plating
Through Silicon Via
Build-up Printed Wiring Boards
Copper Foil Smooth on Both Sides for Lithium Ion Battery
Through Hole Plating.

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