@article{698010,
      recid = {698010},
      author = {Tamin, Mohd N., and Shaffiar, Norhashimah M.,},
      title = {Solder joint reliability assessment finite element  simulation methodology / [electronic resource] :},
      pages = {1 online resource.},
      abstract = {This book presents a systematic approach in performing  reliability assessment of solder joints using Finite  Element (FE) simulation. Essential requirements for FE  modelling of an electronic package or a single reflowed  solder jointsubjected to reliability test conditions are  elaborated. These cover assumptions considered for a  simplified physical model, FE model geometry development,  constitutive models for solder joints and aspects of FE  model validation. Fundamentals of the mechanics of solder  material are adequately reviewed in relation to FE  formulations. Concept of damage is introduced along with  deliberation of cohesive zone model and continuum damage  model for simulation of solder/IMC interface and bulk  solder joint failure, respectively. Applications of the  deliberated methodology to selected problems in assessing  reliability of solder joints are demonstrated. These  industry-defined research-based problems include solder  reflow cooling, temperature cycling and mechanical fatigue  of a BGA package, JEDEC board-level drop test and  mechanisms of solder joint fatigue. Emphasis is placed on  accurate quantitative assessment of solder joint  reliability through basic understanding of the mechanics of  materials as interpreted from results of FE simulations.  The FE simulation methodology is readily applicable to  numerous other problems in mechanics of materials and  structures.},
      url = {http://library.usi.edu/record/698010},
      doi = {https://doi.org/10.1007/978-3-319-00092-3},
}