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000698010 020__ $$a9783319000923 $$qelectronic book
000698010 020__ $$a3319000926 $$qelectronic book
000698010 020__ $$z9783319000916
000698010 0247_ $$a10.1007/978-3-319-00092-3$$2doi
000698010 035__ $$aSP(OCoLC)ocn878669485
000698010 035__ $$aSP(OCoLC)878669485
000698010 040__ $$aGW5XE$$beng$$erda$$epn$$cGW5XE$$dN$T$$dYDXCP$$dCOO
000698010 049__ $$aISEA
000698010 050_4 $$aTT267
000698010 08204 $$a671.52042$$223
000698010 1001_ $$aTamin, Mohd N.,$$eauthor.
000698010 24510 $$aSolder joint reliability assessment$$h[electronic resource] :$$bfinite element simulation methodology /$$cMohd N. Tamin, Norhashimah M. Shaffiar.
000698010 264_1 $$aCham :$$bSpringer,$$c2014.
000698010 300__ $$a1 online resource.
000698010 336__ $$atext$$btxt$$2rdacontent
000698010 337__ $$acomputer$$bc$$2rdamedia
000698010 338__ $$aonline resource$$bcr$$2rdacarrier
000698010 4901_ $$aAdvanced structured materials ;$$vvolume 37
000698010 5050_ $$aOverview of the Simulation Methodology -- Requirements for Finite Element Simulation -- Mechanics of Solder Materials -- Application I: Solder Joint Reflow Process -- Application II: Solder Joints under Temperature and Mechanical Cycles -- Damage Mechanics-based Models -- Application III: Board-level Drop Test with BGA Package -- Fatigue Fracture Process of Solder Joints -- Closure.
000698010 506__ $$aAccess limited to authorized users.
000698010 520__ $$aThis book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder jointsubjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.
000698010 588__ $$aDescription based on print version record.
000698010 650_0 $$aSolder and soldering.
000698010 650_0 $$aWelded joints$$xReliability.
000698010 7001_ $$aShaffiar, Norhashimah M.,$$eauthor.
000698010 77608 $$iPrint version:$$aTamin, Mohd N., author.$$tSolder joint reliability assessment$$z9783319000916$$w(OCoLC)857525278
000698010 830_0 $$aAdvanced structured materials ;$$vv.37.
000698010 852__ $$bebk
000698010 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://dx.doi.org/10.1007/978-3-319-00092-3$$zOnline Access
000698010 909CO $$ooai:library.usi.edu:698010$$pGLOBAL_SET
000698010 980__ $$aEBOOK
000698010 980__ $$aBIB
000698010 982__ $$aEbook
000698010 983__ $$aOnline
000698010 994__ $$a92$$bISE