Preface; Contents; Chapter 1: Introduction of High Power Semiconductor Lasers; 1.1 The Fundamental Principle of Semiconductor Lasers; 1.1.1 Energy Band Theory; 1.1.2 Principle of Semiconductor Lasers; 1.2 Device Structure; 1.2.1 Gain Medium Structures; 1.2.2 Physical Structure; 1.3 High Power Designs and Considerations; 1.3.1 Broad Emitting Area; 1.3.2 Long Cavity; 1.3.3 Broadened Waveguide Design; 1.3.4 Fill Factor; 1.3.5 Facet Passivation; 1.3.6 Tapered Lateral Structure; 1.4 Basic Characteristics and Parameters; 1.4.1 Wavelength; 1.4.2 Output Power; 1.4.3 Slope Efficiency

1.4.4 Threshold Current1.4.5 Spectrum; 1.4.6 Near Field; 1.4.7 Far Field; 1.4.8 Beam Quality; 1.4.9 Life Time; References; Chapter 2: Overview of High Power Semiconductor Laser Packages; 2.1 Open Packages; 2.1.1 Packaging Structure of Single Emitter Semiconductor Lasers; 2.1.2 Packaging Structure of Multi-emitter Semiconductor Lasers; 2.1.3 Packaging Structure of Single Bar Semiconductor Lasers; 2.1.4 Packaging Structure of Multi-bar Semiconductor Lasers; 2.2 Fiber-Coupled Packages; 2.2.1 Packaging Structure of Single Emitter Modules; 2.2.2 Packaging Structure of Multi-emitter Modules

2.2.3 Packaging Structure of Single Bar Modules2.2.4 Packaging Structure of Multi-bar Modules; References; Chapter 3: Thermal Design and Management in High Power Semiconductor Laser Packaging; 3.1 Temperature Effect on Performances of High Power Semiconductor Lasers; 3.1.1 Threshold; 3.1.2 Slope Efficiency; 3.1.3 Output Power; 3.1.4 Wavelength; 3.1.5 Lifetime; 3.2 Heat Generation Sources; 3.2.1 Heat Sources of Single Emitter Semiconductor Lasers; 3.2.2 Heat Sources of Semiconductor Laser Bars; 3.3 Thermal Modeling, Design and Analysis; 3.3.1 Finite Element Thermal Modeling and Design

3.3.2 Thermal Design and Analysis of Single Emitter Semiconductor Lasers3.3.3 Thermal Design and Analysis of Conduction-Cooled Semiconductor Laser Bars; Thermal Modeling and Behavior of CS Package; Thermal Analysis and Optimization of CS Package; Thermal Modeling and Behavior of HCS Package; Thermal Analysis and Optimization of HCS Package; 3.4 Thermal Management Techniques; 3.4.1 Double-Sided Cooling; 3.4.2 Macro-channel Cooling; 3.4.3 Advanced Packaging Materials; References; Chapter 4: Thermal Stress in High Power Semiconductor Lasers

4.1 Effects of Thermal Stress on Performances of High Power Semiconductor Lasers4.1.1 Wavelength; 4.1.2 Polarization; 4.1.3 Smile; 4.1.4 Cracking; 4.2 Analysis of Thermal Stress in High Power Semiconductor Lasers; 4.3 Thermal Stress Minimization; 4.3.1 Bonding Material; 4.3.2 Mounting Substrate; 4.3.3 Advanced Composite Materials; References; Chapter 5: Optical Design and Beam Shaping in High Power Semiconductor Lasers; 5.1 Optical Characteristics of Semiconductor Lasers; 5.1.1 Single Emitters; 5.1.2 Diode Laser Bars; 5.1.3 Diode Laser Stacks; 5.2 Beam Shaping and Fiber Coupling