@article{723361,
      recid = {723361},
      author = {Liu, Hui, and Liu, Xingsheng, and Xiong, Linling, and  Zhao, Wei,},
      title = {Packaging of high power semiconductor lasers [electronic  resource] /},
      pages = {1 online resource.},
      abstract = {This book introduces high power semiconductor laser  packaging design. The characteristics and challenges of the  design and various packaging, processing, and testing  techniques are detailed by the authors. New technologies,  in particular thermal technologies, current applications,  and trends in high power semiconductor laser packaging are  described at length and assessed.},
      url = {http://library.usi.edu/record/723361},
      doi = {https://doi.org/10.1007/978-1-4614-9263-4},
}