TY  - GEN
AB  - This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
AU  - Liu, Hui,
AU  - Liu, Xingsheng,
AU  - Xiong, Linling,
AU  - Zhao, Wei,
CN  - QC689.55.S45
DO  - 10.1007/978-1-4614-9263-4
DO  - doi
ID  - 723361
KW  - Semiconductor lasers.
KW  - Electronic packaging.
LK  - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-1-4614-9263-4
N2  - This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
SN  - 9781461492634
SN  - 1461492637
T1  - Packaging of high power semiconductor lasers
TI  - Packaging of high power semiconductor lasers
UR  - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-1-4614-9263-4
ER  -