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000723361 019__ $$a892239221
000723361 020__ $$a9781461492634$$qelectronic book
000723361 020__ $$a1461492637$$qelectronic book
000723361 020__ $$z9781461492627
000723361 0247_ $$a10.1007/978-1-4614-9263-4$$2doi
000723361 035__ $$aSP(OCoLC)ocn884505591
000723361 035__ $$aSP(OCoLC)884505591$$z(OCoLC)892239221
000723361 040__ $$aGW5XE$$beng$$erda$$epn$$cGW5XE$$dN$T$$dCOO$$dOCLCF$$dEBLCP$$dDEBSZ
000723361 049__ $$aISEA
000723361 050_4 $$aQC689.55.S45
000723361 08204 $$a621.366$$223
000723361 24500 $$aPackaging of high power semiconductor lasers$$h[electronic resource] /$$cHui Liu, Xingsheng Liu, Lingling Xiong, Wei Zhao.
000723361 264_1 $$aNew York :$$bSpringer,$$c2014.
000723361 300__ $$a1 online resource.
000723361 336__ $$atext$$btxt$$2rdacontent
000723361 337__ $$acomputer$$bc$$2rdamedia
000723361 338__ $$aonline resource$$bcr$$2rdacarrier
000723361 4901_ $$aMicro- and opto-electronic materials, structures, and systems
000723361 504__ $$aIncludes bibliographical references and index.
000723361 5050_ $$aPreface; Contents; Chapter 1: Introduction of High Power Semiconductor Lasers; 1.1 The Fundamental Principle of Semiconductor Lasers; 1.1.1 Energy Band Theory; 1.1.2 Principle of Semiconductor Lasers; 1.2 Device Structure; 1.2.1 Gain Medium Structures; 1.2.2 Physical Structure; 1.3 High Power Designs and Considerations; 1.3.1 Broad Emitting Area; 1.3.2 Long Cavity; 1.3.3 Broadened Waveguide Design; 1.3.4 Fill Factor; 1.3.5 Facet Passivation; 1.3.6 Tapered Lateral Structure; 1.4 Basic Characteristics and Parameters; 1.4.1 Wavelength; 1.4.2 Output Power; 1.4.3 Slope Efficiency
000723361 5058_ $$a1.4.4 Threshold Current1.4.5 Spectrum; 1.4.6 Near Field; 1.4.7 Far Field; 1.4.8 Beam Quality; 1.4.9 Life Time; References; Chapter 2: Overview of High Power Semiconductor Laser Packages; 2.1 Open Packages; 2.1.1 Packaging Structure of Single Emitter Semiconductor Lasers; 2.1.2 Packaging Structure of Multi-emitter Semiconductor Lasers; 2.1.3 Packaging Structure of Single Bar Semiconductor Lasers; 2.1.4 Packaging Structure of Multi-bar Semiconductor Lasers; 2.2 Fiber-Coupled Packages; 2.2.1 Packaging Structure of Single Emitter Modules; 2.2.2 Packaging Structure of Multi-emitter Modules
000723361 5058_ $$a2.2.3 Packaging Structure of Single Bar Modules2.2.4 Packaging Structure of Multi-bar Modules; References; Chapter 3: Thermal Design and Management in High Power Semiconductor Laser Packaging; 3.1 Temperature Effect on Performances of High Power Semiconductor Lasers; 3.1.1 Threshold; 3.1.2 Slope Efficiency; 3.1.3 Output Power; 3.1.4 Wavelength; 3.1.5 Lifetime; 3.2 Heat Generation Sources; 3.2.1 Heat Sources of Single Emitter Semiconductor Lasers; 3.2.2 Heat Sources of Semiconductor Laser Bars; 3.3 Thermal Modeling, Design and Analysis; 3.3.1 Finite Element Thermal Modeling and Design
000723361 5058_ $$a3.3.2 Thermal Design and Analysis of Single Emitter Semiconductor Lasers3.3.3 Thermal Design and Analysis of Conduction-Cooled Semiconductor Laser Bars; Thermal Modeling and Behavior of CS Package; Thermal Analysis and Optimization of CS Package; Thermal Modeling and Behavior of HCS Package; Thermal Analysis and Optimization of HCS Package; 3.4 Thermal Management Techniques; 3.4.1 Double-Sided Cooling; 3.4.2 Macro-channel Cooling; 3.4.3 Advanced Packaging Materials; References; Chapter 4: Thermal Stress in High Power Semiconductor Lasers
000723361 5058_ $$a4.1 Effects of Thermal Stress on Performances of High Power Semiconductor Lasers4.1.1 Wavelength; 4.1.2 Polarization; 4.1.3 Smile; 4.1.4 Cracking; 4.2 Analysis of Thermal Stress in High Power Semiconductor Lasers; 4.3 Thermal Stress Minimization; 4.3.1 Bonding Material; 4.3.2 Mounting Substrate; 4.3.3 Advanced Composite Materials; References; Chapter 5: Optical Design and Beam Shaping in High Power Semiconductor Lasers; 5.1 Optical Characteristics of Semiconductor Lasers; 5.1.1 Single Emitters; 5.1.2 Diode Laser Bars; 5.1.3 Diode Laser Stacks; 5.2 Beam Shaping and Fiber Coupling
000723361 506__ $$aAccess limited to authorized users.
000723361 520__ $$aThis book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
000723361 588__ $$aDescription based on print version record.
000723361 650_0 $$aSemiconductor lasers.
000723361 650_0 $$aElectronic packaging.
000723361 7001_ $$aLiu, Hui,$$eauthor.
000723361 7001_ $$aLiu, Xingsheng,$$eauthor.
000723361 7001_ $$aXiong, Linling,$$eauthor.
000723361 7001_ $$aZhao, Wei,$$cPh.D.,$$eauthor.
000723361 77608 $$iPrint version:$$tPackaging of high power semiconductor lasers$$z9781461492627$$w(OCoLC)862760520
000723361 830_0 $$aMicro- and opto-electronic materials. structures. and systems.
000723361 852__ $$bebk
000723361 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-1-4614-9263-4$$zOnline Access$$91397441.1
000723361 909CO $$ooai:library.usi.edu:723361$$pGLOBAL_SET
000723361 980__ $$aEBOOK
000723361 980__ $$aBIB
000723361 982__ $$aEbook
000723361 983__ $$aOnline
000723361 994__ $$a92$$bISE