000723411 000__ 05459cam\a2200505Ii\4500 000723411 001__ 723411 000723411 005__ 20230306140337.0 000723411 006__ m\\\\\o\\d\\\\\\\\ 000723411 007__ cr\cn\nnnunnun 000723411 008__ 140811t20142015sz\a\\\\ob\\\\001\0\eng\d 000723411 019__ $$a894170482 000723411 020__ $$a9783319091112$$qelectronic book 000723411 020__ $$a3319091115$$qelectronic book 000723411 020__ $$z9783319091105 000723411 0247_ $$a10.1007/978-3-319-09111-2$$2doi 000723411 035__ $$aSP(OCoLC)ocn886380214 000723411 035__ $$aSP(OCoLC)886380214$$z(OCoLC)894170482 000723411 040__ $$aGW5XE$$beng$$erda$$epn$$cGW5XE$$dN$T$$dCOO$$dYDXCP$$dOCLCF$$dEBLCP$$dDEBSZ 000723411 049__ $$aISEA 000723411 050_4 $$aTK7870 000723411 08204 $$a621.381$$223 000723411 1001_ $$aNatarajan, Dhanasekharan,$$eauthor. 000723411 24510 $$aReliable design of electronic equipment$$h[electronic resource] :$$ban engineering guide /$$cDhanasekharan Natarajan. 000723411 264_1 $$aCham :$$bSpringer,$$c[2014] 000723411 264_4 $$c©2015 000723411 300__ $$a1 online resource (xvii, 150 pages) :$$billustrations 000723411 336__ $$atext$$btxt$$2rdacontent 000723411 337__ $$acomputer$$bc$$2rdamedia 000723411 338__ $$aonline resource$$bcr$$2rdacarrier 000723411 504__ $$aIncludes bibliographical references and index. 000723411 5050_ $$aPreface; Acknowledgments; Contents; About the Author; 1 Overview of Reliability Design; Abstract; 1.1...Design and Development of Electronic Equipment; 1.2...Engineering Reliability in Design and Development; 1.2.1 Reliability Techniques for Design Process; 1.2.2 Reliability Techniques for Development Process; 1.3...Computerized System for Reliability Design; 2 Generic Stress Factors and De-rating; Abstract; 2.1...Introduction; 2.2...Ambient Temperature; 2.3...Surface Temperature; 2.4...Thermal Resistance; 2.5...Junction Temperature; 2.5.1 Computing Junction Temperature; 2.6...Basics of De-rating 000723411 5058_ $$a2.6.1 Need for De-rating2.6.2 Examples of De-rating; 2.6.2.1 De-rating for Power Dissipation; A.1. Assessment Exercises; References; 3 Selection and Application of Components; Abstract; 3.1...Basis of Selection; 3.2...Reliability Needs of Components; 3.2.1 De-rating for Stress Factors; 3.2.2 Application of Components; 3.3...Stress Factors and Application Information; 3.3.1 Integrated Circuits; 3.3.1.1 Stress Factors for De-rating; 3.3.1.2 Application Reliability Information; 3.3.2 Discrete Semiconductor Devices; 3.3.2.1 Stress Factors for De-rating; 3.3.2.2 Application Reliability Information 000723411 5058_ $$a3.3.3 Resistors3.3.3.1 Stress Factors for De-rating; 3.3.3.2 Application Reliability Information; 3.3.4 Capacitors; 3.3.4.1 Stress Factors for De-rating; 3.3.4.2 Application Reliability Information; 3.3.5 Inductors and Transformers; 3.3.5.1 Stress Factors for De-rating; 3.3.5.2 Application Reliability Information; 3.3.6 Connectors; 3.3.6.1 Stress Factors for De-rating; 3.3.6.2 Application Reliability Information; 3.3.7 Switches; 3.3.7.1 Stress Factors for De-rating; 3.3.7.2 Application Reliability Information; 3.3.8 Relays; 3.3.8.1 Stress Factors for De-rating 000723411 5058_ $$a3.3.8.2 Application Reliability Information3.3.9 Fuses; 3.3.9.1 Stress Factors for De-rating; 3.3.9.2 Application Reliability Information; 3.3.10 Coaxial Cables and PCBs; A.1. Assessment Exercises; A.2. Research Assignments; References; 4 Failure Mode and Effects Analysis; Abstract; 4.1...Introduction; 4.2...Significance of FMEA; 4.3...Examples of FMEA in Design ; 4.4...Benefits of FMEA; 4.5...Organizing FMEA; 4.5.1 Planning in Design; 4.5.2 Resources; 4.5.2.1 Software Support; 4.5.3 Assigning FMEA; 4.6...Terms in FMEA ; 4.6.1 Failure Mode; 4.6.2 Failure Effect; 4.6.3 Failure Cause 000723411 5058_ $$a4.6.4 Preventive Actions4.6.5 Characterizing Failure Mode; 4.6.5.1 Unambiguous Failure Modes; 4.6.5.2 Independent Failure Modes; 4.7...FMEA at Module Level ; 4.7.1 Interconnection FMEA; 4.7.2 Library of Preventive Actions; 4.7.3 Maintenance Flow Diagrams; 4.8...FMEA at Component Level; A.1. Assessment Exercises; A.2. Research Assignments; References; 5 Overstress Analysis; Abstract; 5.1...Need for Overstress Analysis; 5.2...Benefits of Overstress Analysis; 5.3...Types of Overstress; 5.3.1 Transient Electrical Overstress; 5.3.2 Operating Electrical Overstress; 5.3.3 Thermal Overstress 000723411 506__ $$aAccess limited to authorized users. 000723411 520__ $$aThis book explains reliability techniques with examples from electronics design for the benefit of engineers. It presents the application of de-rating, FMEA, overstress analyses and reliability improvement tests for designing reliable electronic equipment. Adequate information is provided for designing computerized reliability database system to support the application of the techniques by designers. Pedantic terms and the associated mathematics of reliability engineering discipline are excluded for the benefit of comprehensiveness and practical applications. This book offers excellent support. 000723411 588__ $$aDescription based on online resource; title from PDF title page (SpringerLink, viewed August 11, 2014). 000723411 650_0 $$aElectronic apparatus and appliances$$xReliability. 000723411 650_0 $$aElectronic apparatus and appliances$$xDesign and construction. 000723411 77608 $$iPrint version:$$aNatarajan, Dhanasekharan.$$tReliable Design of Electronic Equipment : An Engineering Guide$$dDordrecht : Springer,c2014$$z9783319091105 000723411 852__ $$bebk 000723411 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-09111-2$$zOnline Access$$91397441.1 000723411 909CO $$ooai:library.usi.edu:723411$$pGLOBAL_SET 000723411 980__ $$aEBOOK 000723411 980__ $$aBIB 000723411 982__ $$aEbook 000723411 983__ $$aOnline 000723411 994__ $$a92$$bISE