Thermal transport in oblique finned micro/minichannels [electronic resource] / Yan Fan, Poh Seng Lee, Pawan Kumar Singh, Yong Jiun Lee.
2014
TJ260
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Title
Thermal transport in oblique finned micro/minichannels [electronic resource] / Yan Fan, Poh Seng Lee, Pawan Kumar Singh, Yong Jiun Lee.
ISBN
9783319096476 electronic book
3319096478 electronic book
9783319096469
3319096478 electronic book
9783319096469
Published
Cham : Springer, [2014]
Copyright
©2015
Language
English
Description
1 online resource (xiii, 130 pages) : illustrations (some color).
Item Number
10.1007/978-3-319-09647-6 doi
Call Number
TJ260
Dewey Decimal Classification
621.402/2
Summary
The main aim of this book is to introduce and give an overview of a novel, easy, and highly effective heat transfer augmentation technique for single-phase micro/minichannel heat sink. The specific objectives of the℗ volume℗ are℗ to:℗ Introduce a novel planar oblique fin microchannel and cylindrical oblique fin minichannel heat sink design using passive heat transfer enhancement techniques ℗ Investigate the thermal transport in both planar and cylindrical oblique fin structures through numerical simulation and systematic experimental studies.
Bibliography, etc. Note
Includes bibliographical references.
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Access limited to authorized users.
Source of Description
Online resource; title from PDF title page (SpringerLink, viewed November 3, 2014).
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Series
SpringerBriefs in applied sciences and technology. Thermal engineering and applied science,
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