Preface; Contents; About the Authors; 1 Interconnects; Abstract ; 1.1 Introduction; 1.2 Types of Interconnects; 1.3 Evolution of Interconnects; 1.3.1 Aluminum Interconnects; 1.3.2 Reason Behind the Replacement of Al by Cu; 1.3.3 Demerits of Cu Interconnects; 1.3.4 Demands in Future Interconnects; 1.4 Carbon Nanotubes: The Ultimate Choice; 2 Carbon Nanotube: Properties and Applications; Abstract ; 2.1 Introduction; 2.2 Structure and Types of Carbon Nanotubes; 2.3 Electronic Band Structure of CNTs; 2.3.1 Band Structure of CNTs from Graphene

2.3.2 Metallicity and Semiconducting Properties of Zigzag CNTs2.4 Properties of CNTs; 2.4.1 Electrical Conductivity; 2.4.2 Strength and Elasticity; 2.4.3 Thermal Conductivity and Expansion; 2.4.4 Field Emission; 2.4.5 Aspect Ratio; 2.4.6 Absorbent; 2.5 Production of CNTs; 2.5.1 Arc Discharge Method; 2.5.2 Laser Method; 2.5.3 Chemical Vapor Deposition; 2.5.4 Ball Milling; 2.5.5 Other Methods; 2.6 Purification of CNTs; 2.6.1 Gas Phase; 2.6.2 Liquid Phase; 2.6.3 Intercalation; 2.7 Application of CNTs; 2.7.1 Structural; 2.7.2 Electromagnetic; 2.7.3 Electroacoustic; 2.7.4 Chemical

2.7.5 Mechanical2.7.6 Optical; 2.7.7 Electrical Circuits; 2.7.8 Interconnects; 2.7.9 Transistors; 3 Modeling of Carbon Nanotube Interconnects; Abstract ; 3.1 Introduction; 3.2 Analytical Models: A Technical Review; 3.2.1 Lüttinger Liquid Theory Based Model; 3.2.2 Electron Transport Theory Based Model; 3.2.3 Models Based on Physical Parameters of CNTs; 3.2.4 Diameter Dependent Modeling of CNT Interconnects; 3.2.5 Models Based on Process Induced Parameters; 3.2.6 Compact Physical Models of SWNT and MWNT Interconnects; 3.2.7 Performance Comparison of SWNT Bundles and MWNT Interconnect Models

3.2.8 CNT Interconnect Models for FPGA Applications3.2.9 CNT Interconnect Models for Crosstalk Analysis; 3.2.10 Modeling of Mixed CNT Bundle Interconnects; 3.3 Geometry and Equivalent RLC Model of CNT Interconnect; 3.3.1 SWNT Interconnect; 3.3.2 DWNT Interconnect; 3.3.3 MWNT Interconnect; 3.3.4 SWNT Bundle Interconnect; 3.3.5 DWNT Bundle Interconnect; 4 Crosstalk and Delay Analysis; Abstract ; 4.1 Introduction; 4.2 Simulation Setup; 4.2.1 Motivation Behind Using CMOS Driver; 4.2.2 Simulation Setup Using Capacitively Coupled Three-Line Bus Architecture

4.3 Crosstalk Induced Delay of Bundled SWNT and DWNT Interconnects4.4 Crosstalk Induced Delay of Bundled SWNT and Single MWNT Interconnects; 4.5 Crosstalk Induced Delay of Bundled SWNT, Bundled DWNT, and Single MWNT Interconnects; 5 Mixed Carbon Nanotube Bundle; Abstract ; 5.1 Introduction; 5.2 Proposed MCB Topologies; 5.3 ESC Model of MCB Interconnects; 5.4 Performance Analysis of MCB Based Interconnects; 5.4.1 Propagation Delay and Power Dissipation of MCB Topologies; 5.4.2 Crosstalk Induced Delay of MCB Topologies; References