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000724290 020__ $$a9781461492665$$qelectronic book
000724290 020__ $$a1461492661$$qelectronic book
000724290 020__ $$z9781461492658
000724290 0247_ $$a10.1007/978-1-4614-9266-5$$2doi
000724290 035__ $$aSP(OCoLC)ocn895189860
000724290 035__ $$aSP(OCoLC)895189860
000724290 040__ $$aGW5XE$$beng$$erda$$epn$$cGW5XE$$dYDXCP$$dEBLCP
000724290 049__ $$aISEA
000724290 050_4 $$aTK7836
000724290 08204 $$a621.381$$223
000724290 24500 $$aFundamentals of lead-free solder interconnect technology$$h[electronic resource] :$$bfrom microstructures to reliability /$$cTae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma.
000724290 264_1 $$aNew York :$$bSpringer,$$c[2014]
000724290 264_4 $$c©2015
000724290 300__ $$a1 online resource.
000724290 336__ $$atext$$btxt$$2rdacontent
000724290 337__ $$acomputer$$bc$$2rdamedia
000724290 338__ $$aonline resource$$bcr$$2rdacarrier
000724290 504__ $$aIncludes bibliographical references and index.
000724290 506__ $$aAccess limited to authorized users.
000724290 588__ $$aOnline resource; title from PDF title page (SpringerLink, viewed November 13, 2014).
000724290 650_0 $$aLead-free electronics manufacturing processes.
000724290 650_0 $$aSolder and soldering.
000724290 7001_ $$aLee, Tae-Kyu,$$eauthor.
000724290 7001_ $$aBieler, Thomas R.,$$eauthor.
000724290 7001_ $$aKim, Choong-Un,$$eauthor.
000724290 7001_ $$aMa, Hongtao,$$eauthor.
000724290 852__ $$bebk
000724290 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-1-4614-9266-5$$zOnline Access$$91397441.1
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000724290 980__ $$aEBOOK
000724290 980__ $$aBIB
000724290 982__ $$aEbook
000724290 983__ $$aOnline
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