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000724486 019__ $$a899563592$$a908083420
000724486 020__ $$a9783319128627$$qelectronic book
000724486 020__ $$a3319128620$$qelectronic book
000724486 020__ $$z9783319128610
000724486 020__ $$z3319128639
000724486 020__ $$z9783319128634
000724486 0247_ $$a10.1007/978-3-319-12862-7$$2doi
000724486 035__ $$aSP(OCoLC)ocn896824783
000724486 035__ $$aSP(OCoLC)896824783$$z(OCoLC)899563592$$z(OCoLC)908083420
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000724486 050_4 $$aQD480
000724486 08204 $$a541.22$$223
000724486 24500 $$aMolecular modeling and multiscaling issues for electronic material applications.$$nVolume 2$$h[electronic resource] /$$cArtur Wymysłowski, Nancy Iwamoto, Matthew Yuen, Haibo Fan, editors.
000724486 264_1 $$aCham :$$bSpringer,$$c[2015]
000724486 264_4 $$c© 2015
000724486 300__ $$a1 online resource.
000724486 336__ $$atext$$btxt$$2rdacontent
000724486 337__ $$acomputer$$bc$$2rdamedia
000724486 338__ $$aonline resource$$bcr$$2rdacarrier
000724486 504__ $$aIncludes bibliographical references.
000724486 5050_ $$aMolecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors -- Two Approaches of Study Cu/Epoxy Interface Enhancement with Benzenethiol Promoter -- Molecular Dynamics Simulation of Pore Formation Mechanism for Deposition of Poly (vinylidene fluoride-co-trifluoroethylene) on Gold Substrate -- Investigating the Influence of Moisture by Molecular Dynamics Simulations -- Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement -- Using Coarse-Grained Molecular Models (Molecular-Mesocale) of a Copper Oxide-Epoxy Interface to Obtain Stress-Strain Failure Predictions which Include Interfacial Roughness, Water and Filler Effects -- Establishment of the Mesoscale Parameters for Separation: A Non-Equilibrium Molecular Dynamics Model -- Mechanics of Graphene and Carbon Nanotubes under Uniaxial Compression and Tension -- Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers.
000724486 506__ $$aAccess limited to authorized users.
000724486 520__ $$aThis book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction. This book also: Discusses multiscale modeling of materials at the mesoscale Highlights current state-of-the-art, novel research topics and achievements in the area of molecular modelling and multiscaling problems of electronic materials and their applications as well as atomistic modeling of mechanical properties Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties
000724486 650_0 $$aMolecules$$xModels.
000724486 650_0 $$aElectronics$$xMaterials.
000724486 650_0 $$aMolecular dynamics.
000724486 650_0 $$aMaterials science.
000724486 7001_ $$aWymysłowski, A.$$q(Artur),$$eeditor.
000724486 7001_ $$aIwamoto, Nancy,$$eeditor.
000724486 7001_ $$aYuen, Matthew,$$eeditor.
000724486 7001_ $$aFan, Haibo,$$eeditor.
000724486 77608 $$iPrint version:$$z3319128639$$z9783319128634
000724486 852__ $$bebk
000724486 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-12862-7$$zOnline Access$$91397441.1
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000724486 980__ $$aEBOOK
000724486 980__ $$aBIB
000724486 982__ $$aEbook
000724486 983__ $$aOnline
000724486 994__ $$a92$$bISE