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000731653 020__ $$z9781608075270$$qhardcover
000731653 020__ $$z1608075273$$qhardcover
000731653 020__ $$a9781608075287$$qelectronic book
000731653 035__ $$a(CaPaEBR)ebr11069355
000731653 040__ $$aCaPaEBR$$beng$$erda$$epn$$cCaPaEBR
000731653 05014 $$aTK7875$$b.C67 2013eb
000731653 08204 $$a621.381$$223
000731653 1001_ $$aCostello, Suzanne,$$eauthor.
000731653 24510 $$aHermeticity testing of MEMS and microelectronic packages$$h[electronic resource] /$$cSuzanne Costello, Marc P.Y. Desmulliez.
000731653 264_1 $$aBoston :$$bArtech House,$$c[2013]
000731653 264_4 $$c©2013
000731653 300__ $$a1 online resource (197 pages) :$$billustrations.
000731653 336__ $$atext$$2rdacontent
000731653 337__ $$acomputer$$2rdamedia
000731653 338__ $$aonline resource$$2rdacarrier
000731653 4901_ $$aIntegrated microsystems series
000731653 504__ $$aIncludes bibliographical references and index.
000731653 5050_ $$aMachine generated contents note: References -- pt. 1 Introduction to Hermetic Packages and Leak Types -- 1.The Evolution of Packages, Their Sealing Methods, and Modes of Fabrication -- 1.1.Introduction -- 1.2.The Evolution of Microelectronics and MEMS Packages -- 1.3.MEMS Sealing Techniques and Mode Package Fabrication -- 1.3.1.Materials -- 1.3.2.Sealing Techniques -- 1.4.Summary of MEMS Packaging Materials and Techniques -- References -- 2.Assembly, Packaging, and Environmentally Induced Failures in MEMS -- 2.1.Introduction -- 2.2.Particle Contamination -- 2.3.Thermomechanical Constraints -- 2.3.1.Thermomechanical Constraints in Die Attach -- 2.3.2.Thermomechanical Constraints in Package-Level Encapsulation -- 2.3.3.Thermomechanical Constraints in Wafer-Level Encapsulation -- 2.3.4.Thermomechanical Constraints in Flip-Chip Bonding -- 2.4.Moisture and Gas Absorption -- 2.4.1.Moisture Absorption -- 2.4.2.Barrier Coatings: A Protection Against Moisture Absorption -- 2.4.3.Outgassing -- 2.5.Conclusions: Reliability Demonstration and Accelerated Testing -- References -- 3.Packaging Requirements for Hermeticity -- 3.1.The Need for Hermeticity in MEMS and Microelectronics Packaging -- 3.2.Balancing Maximum Permissive Leak Rate and Packaging Costs: The Quasi-Hermetic Package -- References -- 4.The Different Types of Leaks in MEMS and Microelectronics Packaging -- 4.1.Introduction -- 4.2.Leak Channels or Capillary Leaks -- 4.3.Permeation -- 4.4.Outgassing -- 4.5.Conclusion -- References -- pt. 2 Traditional Hermeticity Test Techniques and Standards -- 5.Ex Situ Hermeticity Test Methods -- 5.1.Introduction -- 5.2.Fine Leak Tests -- 5.2.1.Helium Fine Leak Test -- 5.2.2.Radioisotope Leak Detection Method -- 5.3.Gross Leak Tests -- 5.3.1.Fluorocarbon Liquid and Vapor Gross Leak Detection -- 5.3.2.Gross Bubble Test -- 5.3.3.Weight Gain -- 5.3.4.Dye Penetrant Gross Leak Test -- 5.4.Combinational Tests -- 5.4.1.Optical Fine/Gross Leak Detection Method -- 5.4.2.Cumulative Helium Leak Detection (CHLD) Method -- References -- 6.The History of Hermeticity Standards MIL-STD-883 T.M. 1014 and MIL-STD-750 T.M. 1071 -- 6.1.Introduction: The First Hermeticity Tests -- 6.2.The Introduction of the Military Standards -- 6.3.The First Problems with Traditional Hermeticity Tests and Standards -- 6.4.Military Standard Revisions -- 6.5.Summary -- References -- pt. 3 Limitations of Existing Hermeticity Test Methods in Low Volume Packages -- 7.Permeation -- 7.1.Introduction -- 7.2.Mathematics of Permeation -- 7.3.Limitations of the Packaging Material -- 7.4.Conclusions -- References -- 8.Outgassing and Residual Gas Analysis (RGA) -- 8.1.Outgassing -- 8.2.Residual Gas Analysis -- References -- 9.Low-Cavity Volume Capillary Leak Limitations -- 9.1.Limitations of the Helium Fine Leak Test Method -- 9.1.1.Volume Limitations -- 9.1.2.Minimum Detectable Leak Rate -- References -- pt. 4 Novel Methods of Leak Detection -- 10.Q-Factor Monitoring of Resonant Microstructures as a Hermeticity Measurement Method -- 10.1.Introduction -- 10.2.Lumped Element Modeling of a Microresonator -- 10.3.Definitions and Measurement Methods of the Quality Factor Q -- 10.3.1.Definition in Terms of Stored Energy -- 10.3.2.Definition in Terms of Bandwidth -- 10.3.3.Determination of the Q-Factor by Amplitude-Frequency Measurement -- 10.3.4.Determination of the Q-Factor by Phase Measurement -- 10.4.Relation Between Pressure and Q-Factor -- References -- 11.In Situ Test Methods in Development -- 11.1.Introduction -- 11.2.Copper Test Structures -- 11.3.Micro-Pirani Gauge -- References -- 12.Ex Situ Hermeticity Test Methods in Development -- 12.1.Introduction -- 12.2.FTIR Spectroscopy -- 12.2.1.Application to Hermeticity -- 12.2.2.Theoretical Limitations -- 12.2.3.Practical Considerations -- 12.2.4.Summary -- 12.3.Raman Spectroscopy -- 12.3.1.Application to the Hermeticity Test -- 12.3.2.Theoretical Limitations -- 12.3.3.Practical Considerations -- 12.3.4.Summary -- References -- pt. 5 Conclusions and Vision -- 13.Summary of Hermeticity Test Methods -- 14.The Way Forward -- 14.1.Introduction -- 14.2.Improvement on Existing Techniques -- 14.3.New Hermetic Materials and Hermeticity Test Methods -- 14.4.Conclusions -- References.
000731653 506__ $$aAccess limited to authorized users.
000731653 588__ $$aDescription based on print version record.
000731653 650_0 $$aMicroelectromechanical systems.
000731653 650_0 $$aMicroelectronics.
000731653 650_0 $$aMicroelectromechanical systems$$xTesting.
000731653 650_0 $$aMicroelectronics$$xTesting.
000731653 7001_ $$aDesmulliez, Marc P. Y.,$$d1963-$$eauthor.
000731653 830_0 $$aArtech House integrated microsystems series.
000731653 85280 $$bebk$$hEbrary Academic Complete
000731653 85640 $$3ProQuest Ebook Central Academic Complete$$uhttps://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=11069355$$zOnline Access
000731653 909CO $$ooai:library.usi.edu:731653$$pGLOBAL_SET
000731653 980__ $$aEBOOK
000731653 980__ $$aBIB
000731653 982__ $$aEbook
000731653 983__ $$aOnline