11th international congress molded interconnect devices [electronic resource] : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jörg Franke [and three others].
2014
TK7882.I6 .I584 2014eb
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Details
Title
11th international congress molded interconnect devices [electronic resource] : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany / edited by Jörg Franke [and three others].
Meeting Name
ISBN
9783038352525
9783038266365 electronic book
9783038266365 electronic book
Published
Pfaffikon, Switzerland : TTP, 2014.
Distributor
Enfield, New Hampshire : Trans Tech Publications Ltd, [date of distribution not identified]
Copyright
©2014
Language
English
Description
1 online resource (119 pages) : illustrations.
Call Number
TK7882.I6 .I584 2014eb
Dewey Decimal Classification
621.367
Bibliography, etc. Note
Includes bibliographical references at the end of each chapters and index.
Access Note
Access limited to authorized users.
Source of Description
Description based on online resource; title from PDF title page (ebrary, viewed October 16, 2014).
Added Author
Series
Advanced materials research ; Volume 1038.
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