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Three dimensional integration of semiconductors [electronic resource] : processing, materials, and applications / Kazuo Kondo, Morihiro Kada, Kenji Takahashi, editors.

Kondo, K. (Kazuo), editor.; Kada, Morihiro, editor.; Takahashi, Kenji, editor.
2015
TK7874.893
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Title
Three dimensional integration of semiconductors [electronic resource] : processing, materials, and applications / Kazuo Kondo, Morihiro Kada, Kenji Takahashi, editors.
ISBN
9783319186757 electronic book
3319186752 electronic book
9783319186740
3319186744
Published
Cham : Springer, 2015.
Language
English
Description
1 online resource (507 pages) : illustrations.
Call Number
TK7874.893
Dewey Decimal Classification
621.3/8152
Bibliography, etc. Note
Includes bibliographical references.
Access Note
Access limited to authorized users.
Source of Description
Description based on print version record.
Added Author
Kondo, K. (Kazuo), editor.
Kada, Morihiro, editor.
Takahashi, Kenji, editor.
Available in Other Form
Three dimensional integration of semiconductors
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Online Resources > Ebooks
All Resources
Research and Development History of Three Dimensional (3D) Integration Technology
Recent Research and Development Activities of Three Dimensional (3D) Integration Technology
TSV Processes
Wafer and Die Bonding Processes
Metrology and Inspection
TSV Characteristics and Reliability: Impact of 3D Integration Processes on Device Reliability
Trends in 3D Integrated Circuit (3D-IC) Testing Technology
Dream Chip Project at ASET.

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