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000746013 001__ 746013
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000746013 020__ $$z9781627081023
000746013 020__ $$a9781627081030$$qelectronic book
000746013 035__ $$a(MiAaPQ)ebr11160634
000746013 040__ $$aMiAaPQ$$beng$$erda$$epn$$cMiAaPQ$$dMiAaPQ
000746013 050_4 $$aTK7871$$b.A86 2015eb
000746013 1112_ $$aInternational Symposium for Testing and Failure Analysis$$n(41st :$$d2015 :$$cPortland, Oregon),$$jorganizer.
000746013 24510 $$aISTFA 2015 conference proceedings from the 41st International Symposium for Testing and Failure Analysis$$h[electronic resource] :$$bNovember 1-5 2015, Oregon Convention Center, Portland, Oregon, USA /$$corganized by ISTFA/2015, Electronic Device Failure Analysis Society (EDFAS), ASM International.
000746013 264_1 $$aMaterials Park, Ohio :$$bASM International,$$c[2015]
000746013 264_4 $$c©2015
000746013 300__ $$a1 online resource (536 pages) :$$billustrations.
000746013 336__ $$atext$$2rdacontent
000746013 337__ $$acomputer$$2rdamedia
000746013 338__ $$aonline resource$$2rdacarrier
000746013 500__ $$aCover title.
000746013 506__ $$aAccess limited to authorized users.
000746013 588__ $$aDescription based on online resource; title from PDF title page (ebrary, viewed March 14, 2016).
000746013 650_0 $$aElectronics$$xMaterials$$xTesting$$vCongresses.
000746013 650_0 $$aMaterials$$xTesting$$vCongresses.
000746013 650_0 $$aElectronic apparatus and appliances$$xTesting$$vCongresses.
000746013 650_0 $$aSemiconductors$$xTesting$$vCongresses.
000746013 7102_ $$aASM International,$$eorganizer.
000746013 7102_ $$aElectronic Device Failure Analysis Society,$$eorganizer.
000746013 852__ $$bebk
000746013 85640 $$3ProQuest Ebook Central Academic Complete$$uhttps://univsouthin.idm.oclc.org/login?url=http://site.ebrary.com/lib/usiricelib/Doc?id=11160634$$zOnline Access
000746013 909CO $$ooai:library.usi.edu:746013$$pGLOBAL_SET
000746013 980__ $$aEBOOK
000746013 980__ $$aBIB
000746013 982__ $$aEbook
000746013 983__ $$aOnline