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000752316 019__ $$a927971192$$a933278629$$a936862650
000752316 020__ $$a9783662488232$$q(electronic book)
000752316 020__ $$a366248823X$$q(electronic book)
000752316 020__ $$z9783662488218
000752316 020__ $$z3662488213
000752316 0247_ $$a10.1007/978-3-662-48823-2$$2doi
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000752316 049__ $$aISEA
000752316 050_4 $$aTK7836
000752316 08204 $$a621.381$$223
000752316 1001_ $$aZhang, Qingke,$$eauthor.
000752316 24510 $$aInvestigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces$$h[electronic resource] /$$cQingke Zhang.
000752316 264_1 $$aBerlin :$$bSpringer,$$c2016.
000752316 300__ $$a1 online resource :$$bcolor illustrations
000752316 336__ $$atext$$btxt$$2rdacontent
000752316 337__ $$acomputer$$bc$$2rdamedia
000752316 338__ $$aonline resource$$bcr$$2rdacarrier
000752316 347__ $$atext file$$bPDF$$2rda
000752316 4901_ $$aSpringerTheses
000752316 500__ $$a"Doctoral thesis accepted by University of Chinese Academy of Sciences, Beijing, China."
000752316 504__ $$aIncludes bibliographical references.
000752316 5050_ $$aResearch Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions.
000752316 506__ $$aAccess limited to authorized users.
000752316 520__ $$aThis thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
000752316 588__ $$aOnline resource; title from PDF title page (viewed November 5, 2015)
000752316 650_0 $$aLead-free electronics manufacturing processes$$xResearch.
000752316 650_0 $$aSolder and soldering$$xDesign and construction.
000752316 650_0 $$aElectronics$$xMaterials.
000752316 77608 $$iPrint version:$$z9783662488218
000752316 830_0 $$aSpringer theses.
000752316 852__ $$bebk
000752316 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-662-48823-2$$zOnline Access$$91397441.1
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000752316 980__ $$aEBOOK
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