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Preface; Contents; Chapter 1: Oxide Driven Strength Degradation of (1 1 1) Silicon Surfaces; 1.1 Introduction; 1.2 Methods; 1.2.1 Sample Preparation; 1.2.2 Fracture Testing Procedure; 1.3 Experiments and Results; 1.3.1 Oxide Removal Experiment; 1.3.2 Atomistic Modeling of Oxidation Induced Strength Changes; 1.3.3 Artificial Oxidation Experiments; 1.4 Summary; References; Chapter 2: In Situ TEM Nanomechanical Testing; 2.1 Introduction; 2.2 Main Text; 2.2.1 Experimental Methods; 2.2.2 Dislocation Processes Associated with the PLC Effect in Al 5754; 2.2.3 Deformation in Nanowires
2.3 Twinning in Nanopillars2.4 Future Directions; References; Chapter 3: Poissonś Ratio as a Damage Index Sensed by Dual-Embedded Fiber Bragg Grating Sensor; 3.1 Introduction; 3.2 Materials and Method; 3.2.1 Composite Materials; 3.2.2 Equipment and Test; 3.3 Results and Discussions; 3.4 Conclusion; References; Chapter 4: In Situ High-Rate Mechanical Testing in the Dynamic Transmission Electron Microscope; 4.1 Introduction; 4.2 Holder Design; 4.3 Sample Preparation; 4.3.1 Standard Machining and Electropolishing; 4.3.2 Femtosecond Laser Machining and Ion Milling
4.3.3 Mounting Specimens for Testing4.3.4 Operating the Holder; 4.4 Dynamic Transmission Electron Microscope; 4.5 Preliminary Results; 4.6 Conclusion; References; Chapter 5: In Situ TEM Observation of Twinning, Detwinning and Retwinning in Quartz; 5.1 Introduction; 5.2 Experimental Procedure; 5.3 Results and Discussion; 5.4 Conclusion; References; Chapter 6: Nano to Macro: Mechanical Evaluation of Macroscopically Long Individual Nanofibers; 6.1 Introduction; 6.2 Methods of Mechanical Testing of 1D Nanomaterials; 6.3 Control of Nanofiber Diameter
6.4 The Protocol for Mechanical Testing and Data Reduction6.5 Future Challenges and Directions; 6.6 Conclusions; References; Chapter 7: Evaluating Pile-Up and Sink-In During Nanoindentation of Thin Films; 7.1 Introduction; 7.2 Experimental Procedure; 7.3 Results and Discussion; 7.4 Conclusions; References; Chapter 8: Tapered Cantilevered Bimorphs for Piezoelectric Energy Harvesting: Characterization with Impedance Spectroscopy; 8.1 Introduction; 8.2 Methodology; 8.3 Results and Discussion; 8.3.1 No Proof Mass; 8.3.2 2g proof mass; 8.3.3 4g Proof Mass; 8.4 Conclusions; References
Chapter 9: Time and Temperature Dependence of Stress Relaxation in Al and Al Alloy Thin Films Application for MEMS9.1 Introduction; 9.2 Experimental; 9.2.1 Sample Design and Fabrication; 9.2.2 Testing System; 9.3 Results; 9.4 Conclusions; References; Chapter 10: Detecting Interconnect Damage in Shock Using Acoustic Emission Detection; 10.1 Introduction; 10.2 Test and Data Reduction Methods; 10.3 Results; 10.4 Conclusions; References; Chapter 11: Application of Nanoindentation and Microdiffraction to Study Aging Effects in Lead Free Solder Interconnects; 11.1 Introduction
2.3 Twinning in Nanopillars2.4 Future Directions; References; Chapter 3: Poissonś Ratio as a Damage Index Sensed by Dual-Embedded Fiber Bragg Grating Sensor; 3.1 Introduction; 3.2 Materials and Method; 3.2.1 Composite Materials; 3.2.2 Equipment and Test; 3.3 Results and Discussions; 3.4 Conclusion; References; Chapter 4: In Situ High-Rate Mechanical Testing in the Dynamic Transmission Electron Microscope; 4.1 Introduction; 4.2 Holder Design; 4.3 Sample Preparation; 4.3.1 Standard Machining and Electropolishing; 4.3.2 Femtosecond Laser Machining and Ion Milling
4.3.3 Mounting Specimens for Testing4.3.4 Operating the Holder; 4.4 Dynamic Transmission Electron Microscope; 4.5 Preliminary Results; 4.6 Conclusion; References; Chapter 5: In Situ TEM Observation of Twinning, Detwinning and Retwinning in Quartz; 5.1 Introduction; 5.2 Experimental Procedure; 5.3 Results and Discussion; 5.4 Conclusion; References; Chapter 6: Nano to Macro: Mechanical Evaluation of Macroscopically Long Individual Nanofibers; 6.1 Introduction; 6.2 Methods of Mechanical Testing of 1D Nanomaterials; 6.3 Control of Nanofiber Diameter
6.4 The Protocol for Mechanical Testing and Data Reduction6.5 Future Challenges and Directions; 6.6 Conclusions; References; Chapter 7: Evaluating Pile-Up and Sink-In During Nanoindentation of Thin Films; 7.1 Introduction; 7.2 Experimental Procedure; 7.3 Results and Discussion; 7.4 Conclusions; References; Chapter 8: Tapered Cantilevered Bimorphs for Piezoelectric Energy Harvesting: Characterization with Impedance Spectroscopy; 8.1 Introduction; 8.2 Methodology; 8.3 Results and Discussion; 8.3.1 No Proof Mass; 8.3.2 2g proof mass; 8.3.3 4g Proof Mass; 8.4 Conclusions; References
Chapter 9: Time and Temperature Dependence of Stress Relaxation in Al and Al Alloy Thin Films Application for MEMS9.1 Introduction; 9.2 Experimental; 9.2.1 Sample Design and Fabrication; 9.2.2 Testing System; 9.3 Results; 9.4 Conclusions; References; Chapter 10: Detecting Interconnect Damage in Shock Using Acoustic Emission Detection; 10.1 Introduction; 10.2 Test and Data Reduction Methods; 10.3 Results; 10.4 Conclusions; References; Chapter 11: Application of Nanoindentation and Microdiffraction to Study Aging Effects in Lead Free Solder Interconnects; 11.1 Introduction