TY  - GEN
T1  - 3D stacked chipsfrom emerging processes to heterogeneous systems /
AU  - Elfadel, Ibrahim M.
AU  - Fettweis, Gerhard P.,
CN  - TK7874.893
N1  - Includes index.
ID  - 755322
KW  - Three-dimensional integrated circuits.
SN  - 9783319204819
SN  - 3319204815
TI  - 3D stacked chipsfrom emerging processes to heterogeneous systems /
LK  - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-20481-9
UR  - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-20481-9
ER  -