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000755322 019__ $$a950055930$$a950466110
000755322 020__ $$a9783319204819$$q(electronic book)
000755322 020__ $$a3319204815$$q(electronic book)
000755322 020__ $$z9783319204802
000755322 035__ $$aSP(OCoLC)ocn949759140
000755322 035__ $$aSP(OCoLC)949759140$$z(OCoLC)950055930$$z(OCoLC)950466110
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000755322 049__ $$aISEA
000755322 050_4 $$aTK7874.893
000755322 08204 $$a621.39/5$$223
000755322 24500 $$a3D stacked chips$$h[electronic resource] :$$bfrom emerging processes to heterogeneous systems /$$cIbrahim (Abe) M. Elfadel, Gerhard Fettweis, editors.
000755322 264_1 $$aSwitzerland :$$bSpringer,$$c2016.
000755322 300__ $$a1 online resource (xxiii, 339 pages) :$$billustrations.
000755322 336__ $$atext$$btxt$$2rdacontent
000755322 337__ $$acomputer$$bc$$2rdamedia
000755322 338__ $$aonline resource$$bcr$$2rdacarrier
000755322 500__ $$aIncludes index.
000755322 504__ $$aIncludes bibliographical references and index.
000755322 5050_ $$aIntroduction to Electrical 3D Integration -- Copper-based TSV -- Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-.
000755322 506__ $$aAccess limited to authorized users.
000755322 588__ $$aOnline resource; title from PDF title page (SpringerLink, viewed May 20, 2016).
000755322 650_0 $$aThree-dimensional integrated circuits.
000755322 7001_ $$aElfadel, Ibrahim M.$$q(Abe),$$eeditor.
000755322 7001_ $$aFettweis, Gerhard P.,$$eeditor.
000755322 77608 $$iPrint version:$$t3d stacked chips : from emerging processes to heterogeneous systems.$$d[Cham, Switzerland] : Springer, c2016$$z9783319204802$$w2016930408
000755322 852__ $$bebk
000755322 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-20481-9$$zOnline Access$$91397441.1
000755322 909CO $$ooai:library.usi.edu:755322$$pGLOBAL_SET
000755322 980__ $$aEBOOK
000755322 980__ $$aBIB
000755322 982__ $$aEbook
000755322 983__ $$aOnline
000755322 994__ $$a92$$bISE