TY - GEN N2 - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems. DO - 10.1007/978-3-319-46097-0 DO - doi AB - This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems. T1 - VLSI-SoC :design for reliability, security, and low power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised selected papers / AU - Shin, Youngsoo, AU - Tsui, Chi-Ying, AU - Kim, Jae-Joon, AU - Choi, Kiyoung, AU - Reis, Ricardo, VL - 483 CN - QA76.9.C643 N1 - Includes author index. ID - 761443 KW - Internet of things KW - Integrated circuits SN - 9783319460970 SN - 3319460978 TI - VLSI-SoC :design for reliability, security, and low power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised selected papers / LK - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-46097-0 UR - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-46097-0 ER -