000761443 000__ 02867cam\a2200505Ii\4500 000761443 001__ 761443 000761443 005__ 20230306142156.0 000761443 006__ m\\\\\o\\d\\\\\\\\ 000761443 007__ cr\cn\nnnunnun 000761443 008__ 160926s2016\\\\sz\a\\\\o\\\\\101\0\eng\d 000761443 019__ $$a961002894 000761443 020__ $$a9783319460970$$q(electronic book) 000761443 020__ $$a3319460978$$q(electronic book) 000761443 020__ $$z9783319460963 000761443 0247_ $$a10.1007/978-3-319-46097-0$$2doi 000761443 035__ $$aSP(OCoLC)ocn959225692 000761443 035__ $$aSP(OCoLC)959225692$$z(OCoLC)961002894 000761443 040__ $$aGW5XE$$beng$$erda$$epn$$cGW5XE$$dOCLCO$$dNJR$$dYDX$$dOCLCF 000761443 049__ $$aISEA 000761443 050_4 $$aQA76.9.C643 000761443 08204 $$a004.6$$223 000761443 1112_ $$aIFIP WG 10.5/IEEE International Conference on Very Large Scale Integration$$n(23rd :$$d2015 :$$cTaejŏn-si, Korea) 000761443 24510 $$aVLSI-SoC :$$bdesign for reliability, security, and low power : 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, Daejeon, Korea, October 5-7, 2015, Revised selected papers /$$cYoungsoo Shin, Chi Ying Tsui, Jae-Joon Kim, Kiyoung Choi, Ricardo Reis (eds.). 000761443 264_1 $$aSwitzerland :$$bSpringer,$$c2016. 000761443 300__ $$a1 online resource (xiii, 223 pages) :$$billustrations. 000761443 336__ $$atext$$btxt$$2rdacontent 000761443 337__ $$acomputer$$bc$$2rdamedia 000761443 338__ $$aonline resource$$bcr$$2rdacarrier 000761443 4901_ $$aIFIP advances in information and communication technology,$$x1868-4238 ;$$v483 000761443 500__ $$aIncludes author index. 000761443 506__ $$aAccess limited to authorized users. 000761443 520__ $$aThis book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems. 000761443 588__ $$aOnline resource; title from PDF title page (SpringerLink, viewed September 26, 2016). 000761443 650_0 $$aInternet of things$$vCongresses. 000761443 650_0 $$aIntegrated circuits$$xVery large scale integration$$vCongresses. 000761443 7001_ $$aShin, Youngsoo,$$eeditor. 000761443 7001_ $$aTsui, Chi-Ying,$$eeditor. 000761443 7001_ $$aKim, Jae-Joon,$$eeditor. 000761443 7001_ $$aChoi, Kiyoung,$$eeditor. 000761443 7001_ $$aReis, Ricardo,$$eeditor. 000761443 830_0 $$aIFIP advances in information and communication technology ;$$v483. 000761443 852__ $$bebk 000761443 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-46097-0$$zOnline Access$$91397441.1 000761443 909CO $$ooai:library.usi.edu:761443$$pGLOBAL_SET 000761443 980__ $$aEBOOK 000761443 980__ $$aBIB 000761443 982__ $$aEbook 000761443 983__ $$aOnline 000761443 994__ $$a92$$bISE