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Preface; Contents; About the Editor; 1: IoT: Bird's Eye View, Megatrends and Perspectives; 1.1 The Internet of Things: Context and Overview; 1.2 Brief Review of IoT Applications; 1.2.1 Considerations on the IoT Market Volume; 1.2.2 Summary of Current and Prospective Applications of the IoT; 1.3 Requirements of IoT Nodes; 1.3.1 Physical Constraints; 1.3.2 Interaction with the External World; 1.3.3 On-Board Capabilities of IoT Nodes; 1.3.4 User Constraints; 1.4 Looking at the Past: IoT as Natural Outcome of Technological Trends; 1.5 Looking at the Present: Typical Specifications of IoT Nodes
1.5.1 Architecture of IoT Nodes1.5.2 Typical Specifications of Commercial IoT Nodes; 1.6 Present and Future Challenges in Chips for IoT Nodes: Energy Efficiency; 1.6.1 The Wireless Power Issue and the Communication-Computation Tradeoff; 1.6.2 Opportunities to Achieve Highly Energy-Efficient Processing; 1.7 Present and Future Challenges in Chips for IoT Nodes: Security; 1.7.1 Security Challenges in IoT Nodes; 1.7.2 Opportunities to Address Security Challenges on the IoT Node Side: Physically Unclonable Functions (PUFs) and PUF-Enhanc...; 1.8 Present and Future Challenges in IoT Nodes: Cost
1.9 Looking at the Future: IoT Market towards the End of MooreÅ› Law and Related Trends1.9.1 Perspectives on the Growth of the IoT; 1.9.2 Perspectives on the Impact of the IoT on the Semiconductor Industry Structure; 1.10 Looking at the Future: Convergence of IoT and Other Social Megatrends; References; 2: IoT Nodes: System-Level View; 2.1 Architecture of IoT Nodes; 2.2 Requirements for IoT Nodes; 2.2.1 Power; 2.2.2 Cost; 2.2.3 Interoperability; 2.2.4 Security; 2.2.4.1 Wireless Network Threats; 2.2.4.2 Countermeasures; 2.3 Power-Related Challenges and Design Tradeoffs
2.3.1 Node Availability and Duty-Cycled Operation2.3.2 Activity Profile and Power Modes; 2.4 Cost-Related Challenges and Design Tradeoffs; 2.4.1 Impact of Power on Cost of IoT Node and Concentrator; 2.4.2 Impact of Protocol on Cost; 2.5 Pairing and Security; 2.5.1 Pairing, Registration, and Installation of IoT Nodes; 2.5.2 Impact of Security on Power; 2.5.3 Impact of Security, Pairing and Installation on Cost; 2.6 Battery Lifetime and Examples; 2.7 Global System Power Optimization; 2.8 Perspectives and Trends; References; 3: Ultra-Low-Power Digital Architectures for the Internet of Things
3.1 Definitions and Motivations3.2 Ultra-Low-Power Microcontroller Architectures; 3.2.1 Power Management; 3.2.2 IO Architecture; 3.2.3 Data Processing; 3.2.4 Non-volatile Memories; 3.2.5 A Step Forward: Near-Threshold MCU Architectures; 3.2.6 Compensation of Process and Environmental Variations in Near-Threshold; 3.3 From Single Core to Multi Core; 3.3.1 Energy Benefits and Challenges for Parallel ULP Processors; 3.3.2 Memory Hierarchy for Parallel ULP Processors; 3.3.3 SPMs in the Near-Threshold Region; 3.3.4 Architecture of Memory Subsystem for Parallel ULP Processors
1.5.1 Architecture of IoT Nodes1.5.2 Typical Specifications of Commercial IoT Nodes; 1.6 Present and Future Challenges in Chips for IoT Nodes: Energy Efficiency; 1.6.1 The Wireless Power Issue and the Communication-Computation Tradeoff; 1.6.2 Opportunities to Achieve Highly Energy-Efficient Processing; 1.7 Present and Future Challenges in Chips for IoT Nodes: Security; 1.7.1 Security Challenges in IoT Nodes; 1.7.2 Opportunities to Address Security Challenges on the IoT Node Side: Physically Unclonable Functions (PUFs) and PUF-Enhanc...; 1.8 Present and Future Challenges in IoT Nodes: Cost
1.9 Looking at the Future: IoT Market towards the End of MooreÅ› Law and Related Trends1.9.1 Perspectives on the Growth of the IoT; 1.9.2 Perspectives on the Impact of the IoT on the Semiconductor Industry Structure; 1.10 Looking at the Future: Convergence of IoT and Other Social Megatrends; References; 2: IoT Nodes: System-Level View; 2.1 Architecture of IoT Nodes; 2.2 Requirements for IoT Nodes; 2.2.1 Power; 2.2.2 Cost; 2.2.3 Interoperability; 2.2.4 Security; 2.2.4.1 Wireless Network Threats; 2.2.4.2 Countermeasures; 2.3 Power-Related Challenges and Design Tradeoffs
2.3.1 Node Availability and Duty-Cycled Operation2.3.2 Activity Profile and Power Modes; 2.4 Cost-Related Challenges and Design Tradeoffs; 2.4.1 Impact of Power on Cost of IoT Node and Concentrator; 2.4.2 Impact of Protocol on Cost; 2.5 Pairing and Security; 2.5.1 Pairing, Registration, and Installation of IoT Nodes; 2.5.2 Impact of Security on Power; 2.5.3 Impact of Security, Pairing and Installation on Cost; 2.6 Battery Lifetime and Examples; 2.7 Global System Power Optimization; 2.8 Perspectives and Trends; References; 3: Ultra-Low-Power Digital Architectures for the Internet of Things
3.1 Definitions and Motivations3.2 Ultra-Low-Power Microcontroller Architectures; 3.2.1 Power Management; 3.2.2 IO Architecture; 3.2.3 Data Processing; 3.2.4 Non-volatile Memories; 3.2.5 A Step Forward: Near-Threshold MCU Architectures; 3.2.6 Compensation of Process and Environmental Variations in Near-Threshold; 3.3 From Single Core to Multi Core; 3.3.1 Energy Benefits and Challenges for Parallel ULP Processors; 3.3.2 Memory Hierarchy for Parallel ULP Processors; 3.3.3 SPMs in the Near-Threshold Region; 3.3.4 Architecture of Memory Subsystem for Parallel ULP Processors