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000779188 019__ $$a974650059$$a980883025$$a981102478$$a981817092
000779188 020__ $$a9783319445861$$q(electronic book)
000779188 020__ $$a3319445863$$q(electronic book)
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000779188 0247_ $$a10.1007/978-3-319-44586-1$$2doi
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000779188 08204 $$a621.381$$223
000779188 24500 $$a3D microelectronic packaging :$$bfrom fundamentals to applications /$$cYan Li, Deepak Goyal, editors.
000779188 264_1 $$aCham, Switzerland :$$bSpringer,$$c2017.
000779188 300__ $$a1 online resource.
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000779188 4901_ $$aSpringer series in advanced microelectronics,$$x1437-0387 ;$$vvolume 57
000779188 504__ $$aIncludes bibliographical references and index.
000779188 5050_ $$aIntroduction to 3D Microelectronic Packaging -- 3D packaging architecture and assembly process design -- Materials and Processing of TSV -- Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging -- Fundamentals of Electromigration in interconnects of 3D packages -- Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging.
000779188 506__ $$aAccess limited to authorized users.
000779188 520__ $$aThis volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology.
000779188 588__ $$aOnline resource; title from PDF title page (SpringerLink, viewed February 7, 2017).
000779188 650_0 $$aMicroelectronics$$xPackaging.
000779188 7001_ $$aLi, Yan,$$eeditor.
000779188 7001_ $$aGoyal, Deepak,$$eeditor.
000779188 77608 $$iPrint version:$$z9783319445847
000779188 830_0 $$aSpringer series in advanced microelectronics ;$$v57.
000779188 852__ $$bebk
000779188 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-44586-1$$zOnline Access$$91397441.1
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