@article{779515,
      recid = {779515},
      author = {Radojcic, Riko.},
      title = {More-than-Moore 2.5D and 3D SiP integration},
      publisher = {Springer,},
      address = {Cham :},
      pages = {1 online resource (192 pages)},
      year = {2017},
      note = {5.4.3 Concluding Remarks},
      abstract = {This book presents a realistic and a holistic review of  the microelectronic and semiconductor technology options in  the post Moore?s Law regime. Technical tradeoffs, from  architecture down to manufacturing processes, associated  with the 2.5D and 3D integration technologies, as well as  the business and product management considerations  encountered when faced by disruptive technology options,  are presented. Coverage includes a discussion of Integrated  Device Manufacturer (IDM) vs Fabless, vs Foundry, and  Outsourced Assembly and Test (OSAT) barriers to  implementation of disruptive technology options. This book  is a must-read for any IC product team that is considering  getting off the Moore?s Law track, and leveraging some of  the More-than-Moore technology options for their next  microelectronic product. .},
      url = {http://library.usi.edu/record/779515},
      doi = {https://doi.org/10.1007/978-3-319-52548-8},
}