000779984 000__ 05461cam\a2200529Ii\4500 000779984 001__ 779984 000779984 005__ 20230306143048.0 000779984 006__ m\\\\\o\\d\\\\\\\\ 000779984 007__ cr\nn\nnnunnun 000779984 008__ 170306s2017\\\\sz\a\\\\ob\\\\000\0\eng\d 000779984 019__ $$a974738869$$a974960048$$a975019240$$a975039876$$a975106225$$a975424562$$a975966597$$a976041478$$a976194821$$a984860481 000779984 020__ $$a9783319534329$$q(electronic book) 000779984 020__ $$a3319534327$$q(electronic book) 000779984 020__ $$z9783319534312 000779984 020__ $$z3319534319 000779984 0247_ $$a10.1007/978-3-319-53432-9$$2doi 000779984 035__ $$aSP(OCoLC)ocn974641989 000779984 035__ $$aSP(OCoLC)974641989$$z(OCoLC)974738869$$z(OCoLC)974960048$$z(OCoLC)975019240$$z(OCoLC)975039876$$z(OCoLC)975106225$$z(OCoLC)975424562$$z(OCoLC)975966597$$z(OCoLC)976041478$$z(OCoLC)976194821$$z(OCoLC)984860481 000779984 040__ $$aN$T$$beng$$erda$$epn$$cN$T$$dGW5XE$$dEBLCP$$dN$T$$dYDX$$dIDEBK$$dOCLCF$$dUAB$$dNJR$$dIOG$$dCOO$$dAZU$$dUPM 000779984 049__ $$aISEA 000779984 050_4 $$aQC145.4.T5 000779984 08204 $$a536/.42$$223 000779984 1001_ $$aLipnicki, Zygmunt,$$eauthor. 000779984 24510 $$aDynamics of liquid solidification :$$bthermal resistance of contact layer /$$cZygmunt Lipnicki. 000779984 264_1 $$aCham, Switzerland :$$bSpringer,$$c2017. 000779984 300__ $$a1 online resource (xii, 137 pages) :$$billustrations. 000779984 336__ $$atext$$btxt$$2rdacontent 000779984 337__ $$acomputer$$bc$$2rdamedia 000779984 338__ $$aonline resource$$bcr$$2rdacarrier 000779984 347__ $$atext file$$bPDF$$2rda 000779984 4901_ $$aMathematical engineering 000779984 504__ $$aIncludes bibliographical references. 000779984 5050_ $$aAcknowledgements; Contents; About the Author; Introduction; 1 Solidification; 1.1 The General Solidification Problem; 1.2 Equations Describing the Solidification Problem; 2 Solidification of PCMs; 2.1 Heat Storage Based on the Solidification Process; 2.1.1 Multidimensional Solidification Heat Transfer; 2.1.2 Solutions of the Practical Solidification Problem; 2.2 The Geometry of Outer PCMs; 2.3 The Criterion for the Selection of Accumulator Design; 3 The Model of Solidification of a Liquid with the Contact Layer; 3.1 Equations Describing the Problem with the Contact Layer 000779984 5058_ $$a3.2 Strict and Approximate Solution of the One-Dimensional Solidification Problem3.2.1 Strict Solution of the One-Dimensional Solidification Problem; 3.2.2 Approximate Solution of the One-Dimensional Solidification Problem; 4 Solidification on a Rectangular Geometrics; 4.1 The Immovable Layer of Liquid Solidification; 4.2 Forced Convection Effects; 4.2.1 The Effect of the Boundary Layer on the Solidification Process; 4.2.2 Solidification on a Plate with Variable Temperature; 4.3 Free Convection Effect; 4.3.1 Quasi-Stationary Convection in a Vertical Channel 000779984 5058_ $$a4.3.2 Quasi-Stationary Convection in a Horizontal Channel4.3.3 The Simplified Model of Convection with Solidification; 4.3.3.1 Solidification in the Channel with Constant Temperature of the Outer Wall; 4.3.3.2 Solidification in the Channel with External Convective Cooling; 5 Solidification in an Annular Space; 5.1 The Solidification of a Non-heated Liquid; 5.2 Solidification of a Superheated Liquid; 5.2.1 Theoretical Solution of the Solidification Problem; 5.2.2 The Beginning of a Solidification Process-Asymptotic Solution; 5.3 The Experiment; 5.3.1 Research Equipment 000779984 5058_ $$a5.3.2 The Course of the Experiment5.3.3 The Results of the Research and Discussion; 5.3.4 Conclusions; 6 Solidification of a Liquid Flowing into the Channel; 6.1 The General Analysis; 6.2 The Solidification of a Liquid Flowing into a Channel with Weakly Conducting Walls; 6.3 The Solidification of a Liquid Flowing into a Channel with Conducting Walls; 7 Role of the Contact Layer in a Solidification Process; 7.1 Studies of the Thermal Contact Resistance; 7.2 A Theoretical Analysis of Thermal Contact Resistance on the Basis of Experimental Investigations 000779984 5058_ $$a7.2.1 Thermal Contact Resistance for Solidification on a Plate7.2.2 Thermal Contact Resistance for Solidification on a Cylinder; 7.3 Development of the Contact Layer During the Solidification Process; 7.3.1 Development of Contact Layer and Its Role in Phase-Change Process on a Rectangular Plate; 7.3.2 Development of a Contact Layer in Solidification on an Annular Surface; 8 Phase Heat Accumulator; 8.1 Selected Review of the Units Used for Heat Storage; 8.2 Cooperation of the Heat Accumulator Storage with the Heat Pump; 8.3 Example of Calculations; Summary; Annexe 1 (Zalba i in., 2003 000779984 506__ $$aAccess limited to authorized users. 000779984 520__ $$aThis monograph comprehensively describes phenomena of heat flow during phase change as well as the dynamics of liquid solidification, i.e. the development of a solidified layer. The book provides the reader with basic knowledge for practical designs, as well as with equations which describe processes of energy transformation. The target audience primarily comprises researchers and experts in the field of heat flow, but the book may also be beneficial for both practicing engineers and graduate students. 000779984 588__ $$aOnline resource; title from PDF title page (SpringerLink, viewed March 9, 2017). 000779984 650_0 $$aLiquids$$xThermal properties. 000779984 77608 $$iPrint version:$$z3319534319$$z9783319534312$$w(OCoLC)968511668 000779984 830_0 $$aMathematical engineering. 000779984 852__ $$bebk 000779984 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-53432-9$$zOnline Access$$91397441.1 000779984 909CO $$ooai:library.usi.edu:779984$$pGLOBAL_SET 000779984 980__ $$aEBOOK 000779984 980__ $$aBIB 000779984 982__ $$aEbook 000779984 983__ $$aOnline 000779984 994__ $$a92$$bISE