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000780331 020__ $$a9783319516974$$q(electronic book)
000780331 020__ $$a3319516973$$q(electronic book)
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000780331 0247_ $$a10.1007/978-3-319-51697-4$$2doi
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000780331 049__ $$aISEA
000780331 050_4 $$aTK7870.15
000780331 08204 $$a621.381/046$$223
000780331 24500 $$aRF and microwave microelectronics packaging II /$$cKen Kuang, Rick Sturdivant, editors.
000780331 264_1 $$aCham, Switzerland :$$bSpringer,$$c2017.
000780331 300__ $$a1 online resource (xii, 172 pages) :$$billustrations.
000780331 336__ $$atext$$btxt$$2rdacontent
000780331 337__ $$acomputer$$bc$$2rdamedia
000780331 338__ $$aonline resource$$bcr$$2rdacarrier
000780331 347__ $$atext file$$bPDF$$2rda
000780331 500__ $$aIncludes index.
000780331 506__ $$aAccess limited to authorized users.
000780331 520__ $$aReviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
000780331 588__ $$aOnline resource; title from PDF title page (SpringerLink, viewed March 22, 2017).
000780331 588__ $$aDescription based on print  version record.
000780331 650_0 $$aMicroelectronic packaging.
000780331 7001_ $$aKuang, Ken,$$eeditor.
000780331 7001_ $$aSturdivant, Rick,$$eeditor.
000780331 77608 $$iPrint version:$$z3319516965$$z9783319516967$$w(OCoLC)964648011
000780331 852__ $$bebk
000780331 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-51697-4$$zOnline Access$$91397441.1
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000780331 980__ $$aBIB
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