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Preface to the 8 th Edition; Contents; 1 Basic Concepts, Quality & Reliability (RAMS) Assurance of Complex Equipment & Systems; 1.1 Introduction; 1.2 Basic Concepts; 1.2.1 Reliability; 1.2.2 Failure; 1.2.3 Failure Rate, MTTF, MTBF; 1.2.4 Maintenance, Maintainability; 1.2.5 Logistic Support; 1.2.6 Availability; 1.2.7 Safety, Risk, Risk Acceptance; 1.2.8 Quality; 1.2.9 Cost and System Effectiveness; 1.2.10 Product Liability; 1.2.11 Historical Development; 1.3 Basic Tasks & Rules for Quality and Reliability (RAMS) Assurance of Complex Equip. & Systems
1.3.1 Quality and Reliability (RAMS) Assurance Tasks1.3.2 Basic Quality and Reliability (RAMS) Assurance Rules; 1.3.3 Elements of a Quality Assurance System; 1.3.4 Motivation and Training; 2 Reliability Analysis During the Design Phase; 2.1 Introduction; 2.2 Predicted Reliability of Equipment and Systems with Simple Structure; 2.2.1 Required Function; 2.2.2 Reliability Block Diagram; 2.2.3 Operating Conditions at Component Level, Stress Factors; 2.2.4 Failure Rate of Electronic Components; 2.2.5 Reliability of One-Item Structures
2.2.6 Reliability of Series Parallel Structures with Independent Elements2.2.6.1 Systems without Redundancy (series models); 2.2.6.2 Concept of Redundancy; 2.2.6.3 Parallel Models; 2.2.6.4 Series Parallel Structures with Independent Elements; 2.2.6.5 Majority Redundancy; 2.2.7 Part Count Method; 2.3 Reliability of Systems with Complex Structure; 2.3.1 Key Item Method; 2.3.1.1 Bridge Structure; 2.3.1.2 Reliability Block Diagram in Which at Least One Element Appears More than Once; 2.3.2 Successful Path Method; 2.3.3 State Space Method; 2.3.4 Boolean Function Method
2.3.5 Parallel Models with Const. Failure Rates & Load Sharing2.3.6 Elements with more than one Failure Mechanism or one Failure Mode; 2.3.7 Basic Considerations on Fault Tolerant Structures; 2.4 Reliability Allocation and Optimization; 2.5 Mechanical Reliability, Drift Failures; 2.6 Failure Modes Analyses; 2.7 Reliability Aspects in Design Reviews; 3 Qualification Tests for Components and Assemblies; 3.1 Basic Selection Criteria for Electronic Components; 3.1.1 Environment; 3.1.2 Performance Parameters; 3.1.3 Technology; 3.1.4 Manufacturing Quality
3.1.5 Long-Term Behavior of Performance Parameters3.1.6 Reliability; 3.2 Qualification Tests for Complex Electronic Components; 3.2.1 Electrical Test of Complex ICs; 3.2.2 Characterization of Complex ICs; 3.2.3 Environmental and Special Tests of Complex ICs; 3.2.4 Reliability Tests; 3.3 Failure Modes, Failure Mechanisms, and Failure Analysis of Electronic Components; 3.3.1 Failure Modes of Electronic Components; 3.3.2 Failure Mechanisms of Electronic Components; 3.3.3 Failure Analysis of Electronic Components; 3.3.4 Present VLSI Production-Related Reliability Problems
1.3.1 Quality and Reliability (RAMS) Assurance Tasks1.3.2 Basic Quality and Reliability (RAMS) Assurance Rules; 1.3.3 Elements of a Quality Assurance System; 1.3.4 Motivation and Training; 2 Reliability Analysis During the Design Phase; 2.1 Introduction; 2.2 Predicted Reliability of Equipment and Systems with Simple Structure; 2.2.1 Required Function; 2.2.2 Reliability Block Diagram; 2.2.3 Operating Conditions at Component Level, Stress Factors; 2.2.4 Failure Rate of Electronic Components; 2.2.5 Reliability of One-Item Structures
2.2.6 Reliability of Series Parallel Structures with Independent Elements2.2.6.1 Systems without Redundancy (series models); 2.2.6.2 Concept of Redundancy; 2.2.6.3 Parallel Models; 2.2.6.4 Series Parallel Structures with Independent Elements; 2.2.6.5 Majority Redundancy; 2.2.7 Part Count Method; 2.3 Reliability of Systems with Complex Structure; 2.3.1 Key Item Method; 2.3.1.1 Bridge Structure; 2.3.1.2 Reliability Block Diagram in Which at Least One Element Appears More than Once; 2.3.2 Successful Path Method; 2.3.3 State Space Method; 2.3.4 Boolean Function Method
2.3.5 Parallel Models with Const. Failure Rates & Load Sharing2.3.6 Elements with more than one Failure Mechanism or one Failure Mode; 2.3.7 Basic Considerations on Fault Tolerant Structures; 2.4 Reliability Allocation and Optimization; 2.5 Mechanical Reliability, Drift Failures; 2.6 Failure Modes Analyses; 2.7 Reliability Aspects in Design Reviews; 3 Qualification Tests for Components and Assemblies; 3.1 Basic Selection Criteria for Electronic Components; 3.1.1 Environment; 3.1.2 Performance Parameters; 3.1.3 Technology; 3.1.4 Manufacturing Quality
3.1.5 Long-Term Behavior of Performance Parameters3.1.6 Reliability; 3.2 Qualification Tests for Complex Electronic Components; 3.2.1 Electrical Test of Complex ICs; 3.2.2 Characterization of Complex ICs; 3.2.3 Environmental and Special Tests of Complex ICs; 3.2.4 Reliability Tests; 3.3 Failure Modes, Failure Mechanisms, and Failure Analysis of Electronic Components; 3.3.1 Failure Modes of Electronic Components; 3.3.2 Failure Mechanisms of Electronic Components; 3.3.3 Failure Analysis of Electronic Components; 3.3.4 Present VLSI Production-Related Reliability Problems