TY - GEN N2 - This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. DO - 10.1007/978-3-319-67104-8 DO - doi AB - This book contains extended and revised versions of the best papers presented at the 24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, held in Tallinn, Estonia, in September 2016. The 11 papers included in the book were carefully reviewed and selected from the 36 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. T1 - VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability :24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers / AU - Hollstein, Thomas. AU - Raik, Jaan. AU - Kostin, Sergeĭ. AU - Tšertov, Anton. AU - O'Connor, Ian. AU - Reis, Ricardo. VL - 508 CN - TK5105.5-5105.9 ID - 800131 KW - Computer science. KW - Computer hardware. KW - Computer organization. KW - Computer-aided engineering. KW - Electronic circuits. SN - 9783319671048 SN - 3319671049 TI - VLSI-SoC: System-on-Chip in the Nanoscale Era - Design, Verification and Reliability :24th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016, Revised Selected Papers / LK - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-67104-8 UR - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-67104-8 ER -