Linked e-resources
Details
Table of Contents
3D Integration: Technology and Design / P. Franzon
3D SiP for ASIC and 3D DRAM Integration / L. Li
A New Class of High-capacity, Resource-rich FPGAs Enabled by 3D-IC Stacked Silicon Interconnect Technology (SSIT) / S. Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden
Challenges in 3D / M. Koyanagi, T. Fukushima, and T. Tanaka
Wafer-Level Three-Dimensional Integration (3DI) using Bumpless Interconnects and Ultra-Thinning / T. Ohba
3DI stacking technologies for high volume manufacturing by use of wafer level oxide bonding integration / S. Skordas, K. Sakuma, K. Winstel, and C. Kothandaraman
Toward 3D high density / S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio
Novel Platforms and Applications Using 3D and Heterogeneous Integration Technologies / K-N. Chen, Ting-Yang Yu, Yu-Chen Hu, Cheng-Hsien Lu.
3D SiP for ASIC and 3D DRAM Integration / L. Li
A New Class of High-capacity, Resource-rich FPGAs Enabled by 3D-IC Stacked Silicon Interconnect Technology (SSIT) / S. Ramalingam, Henley Liu, Myongseob Kim, Boon Ang, Woon-Seong Kwon, Tom Lee, Susan Wu, Jonathan Chang, Ephrem Wu, Xin Wu, and Liam Madden
Challenges in 3D / M. Koyanagi, T. Fukushima, and T. Tanaka
Wafer-Level Three-Dimensional Integration (3DI) using Bumpless Interconnects and Ultra-Thinning / T. Ohba
3DI stacking technologies for high volume manufacturing by use of wafer level oxide bonding integration / S. Skordas, K. Sakuma, K. Winstel, and C. Kothandaraman
Toward 3D high density / S. Cheramy, A. Jouve, C. Fenouillet-Beranger, P. Vivet, and L. Di Cioccio
Novel Platforms and Applications Using 3D and Heterogeneous Integration Technologies / K-N. Chen, Ting-Yang Yu, Yu-Chen Hu, Cheng-Hsien Lu.