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Preface; Contents; Abbreviations; 1 Introduction; 1.1 The Role of Power Electronics in Renewable Power Systems; 1.1.1 Power Electronics in Wind Energy Systems; 1.1.2 Power Electronics in Solar Energy Systems; 1.1.3 Common Failure Modes of Power Electronic Devices; 1.1.4 Wire Bond LiftOff; 1.1.5 Solder Fatigue; 1.1.6 Reconstruction of Metallization; 1.1.7 Silicon and Silicon Carbide Technologies; 1.1.8 Lead Free Solder and Silver Sintering; 1.2 Reliability and Health Monitoring Issues; References; 2 Thermal Analysis of Power Electronics: Review; 2.1 Overview; 2.2 Electrothermal Modeling
2.2.1 Thermal Modeling2.2.1.1 Finite Element Based Thermal Modeling; 2.2.1.2 Analytical and Finite Element Based Thermal Modeling; 2.2.1.3 Boundary Condition Depended Finite Element Based Thermal Modeling; 2.2.2 Power Loss Modeling; 2.3 Thermomechanical Modeling; 2.3.1 Temperature and Power Cycling; 2.3.2 Warpage; 2.3.3 Sintering; 2.3.4 Wire Bond; 2.4 Lifetime Analysis and Reliability of Power Electronic Devices; 2.5 Electrothermal Performance of Silicon and Silicon Carbide Technologies; 2.6 Thermal Modeling of PECs in Wind Energy Applications
2.7 Thermal Modeling of PECs in Solar Energy ApplicationsReferences; 3 Fundamental Thermal Characterization of PECs; 3.1 Overview; 3.2 Design and Performance of Power Electronic Devices; 3.3 Energy and Power Loss Modeling; 3.4 Thermal Modeling Methodology; 3.5 Thermal Impedance and Heat Path; 3.6 Cauer and Foster Thermal Networks; 3.7 Heat Transfer and Thermal Modeling Implementation in Simulink; 3.8 Validation of Thermal Model with FEM; 3.9 An Analytical Solution for Heat Path Based on Spreading Effect; 3.10 Thermal Modeling in Discrete Domain; 3.11 A 3D FE Model of Multichip Power Module
3.12 Operation of Thermal Impedance Matrix3.13 Thermal Impedance Extraction of Internal Layers; 3.14 Implementation of Electrothermal Model with Cross-Coupling Effect; 3.15 Validation of the Simulink Model with FEM; 3.16 Implementation of Ideal Switching with Cross-Coupling Heat Effect; 3.17 Effect of the Cross-Coupling Heat Effect; 3.18 Effect of the Cooling Boundary Conditions; 3.19 Summary; References; 4 Thermal Stress Effects on Reliability; 4.1 Overview; 4.2 Thermomechanical Modeling of Power Electronic Modules; 4.3 Thermomechanical Model of IGBT Power Module
4.4 Reliability Modeling and Lifetime Analysis4.5 Lifetime Analysis for Discrete IGBT Devices; References; 5 Thermal Characteristics of Boost Converters; 5.1 Overview; 5.2 Insulated Gate Bipolar Transistors; 5.3 DC/DC Boost Converter; 5.3.1 Operating Principle of DC/DC Boost Converter; 5.3.2 Design Principle of DC/DC Boost Converter; 5.3.3 Design Principle of Small Signal Equation for the DC/DC Boost Converter; 5.4 Physical Boost Converter Design; 5.4.1 Switching Devices; 5.4.2 Inductor; 5.5 Power Diode; 5.5.1 Capacitors; 5.6 Driver Unit Design; 5.6.1 Opt Coupler; 5.6.2 Driver
2.2.1 Thermal Modeling2.2.1.1 Finite Element Based Thermal Modeling; 2.2.1.2 Analytical and Finite Element Based Thermal Modeling; 2.2.1.3 Boundary Condition Depended Finite Element Based Thermal Modeling; 2.2.2 Power Loss Modeling; 2.3 Thermomechanical Modeling; 2.3.1 Temperature and Power Cycling; 2.3.2 Warpage; 2.3.3 Sintering; 2.3.4 Wire Bond; 2.4 Lifetime Analysis and Reliability of Power Electronic Devices; 2.5 Electrothermal Performance of Silicon and Silicon Carbide Technologies; 2.6 Thermal Modeling of PECs in Wind Energy Applications
2.7 Thermal Modeling of PECs in Solar Energy ApplicationsReferences; 3 Fundamental Thermal Characterization of PECs; 3.1 Overview; 3.2 Design and Performance of Power Electronic Devices; 3.3 Energy and Power Loss Modeling; 3.4 Thermal Modeling Methodology; 3.5 Thermal Impedance and Heat Path; 3.6 Cauer and Foster Thermal Networks; 3.7 Heat Transfer and Thermal Modeling Implementation in Simulink; 3.8 Validation of Thermal Model with FEM; 3.9 An Analytical Solution for Heat Path Based on Spreading Effect; 3.10 Thermal Modeling in Discrete Domain; 3.11 A 3D FE Model of Multichip Power Module
3.12 Operation of Thermal Impedance Matrix3.13 Thermal Impedance Extraction of Internal Layers; 3.14 Implementation of Electrothermal Model with Cross-Coupling Effect; 3.15 Validation of the Simulink Model with FEM; 3.16 Implementation of Ideal Switching with Cross-Coupling Heat Effect; 3.17 Effect of the Cross-Coupling Heat Effect; 3.18 Effect of the Cooling Boundary Conditions; 3.19 Summary; References; 4 Thermal Stress Effects on Reliability; 4.1 Overview; 4.2 Thermomechanical Modeling of Power Electronic Modules; 4.3 Thermomechanical Model of IGBT Power Module
4.4 Reliability Modeling and Lifetime Analysis4.5 Lifetime Analysis for Discrete IGBT Devices; References; 5 Thermal Characteristics of Boost Converters; 5.1 Overview; 5.2 Insulated Gate Bipolar Transistors; 5.3 DC/DC Boost Converter; 5.3.1 Operating Principle of DC/DC Boost Converter; 5.3.2 Design Principle of DC/DC Boost Converter; 5.3.3 Design Principle of Small Signal Equation for the DC/DC Boost Converter; 5.4 Physical Boost Converter Design; 5.4.1 Switching Devices; 5.4.2 Inductor; 5.5 Power Diode; 5.5.1 Capacitors; 5.6 Driver Unit Design; 5.6.1 Opt Coupler; 5.6.2 Driver