TY - GEN N2 - The book contains high quality papers presented in the Fifth International Conference on Innovations in Electronics and Communication Engineering (ICIECE 2016) held at Guru Nanak Institutions, Hyderabad, India during 8 and 9 July 2016. The objective is to provide the latest developments in the field of electronics and communication engineering specially the areas like Image Processing, Wireless Communications, Radar Signal Processing, Embedded Systems and VLSI Design. The book aims to provide an opportunity for researchers, scientists, technocrats, academicians and engineers to exchange their innovative ideas and research findings in the field of Electronics and Communication Engineering. DO - 10.1007/978-981-10-3812-9 DO - doi AB - The book contains high quality papers presented in the Fifth International Conference on Innovations in Electronics and Communication Engineering (ICIECE 2016) held at Guru Nanak Institutions, Hyderabad, India during 8 and 9 July 2016. The objective is to provide the latest developments in the field of electronics and communication engineering specially the areas like Image Processing, Wireless Communications, Radar Signal Processing, Embedded Systems and VLSI Design. The book aims to provide an opportunity for researchers, scientists, technocrats, academicians and engineers to exchange their innovative ideas and research findings in the field of Electronics and Communication Engineering. T1 - Innovations in electronics and communication engineering :proceedings of the Fifth ICIECE 2016 / DA - [2018] CY - Singapore : AU - Saini, H. S., AU - Singh, R. K., AU - Reddy, K. Satish, VL - 7 CN - TK5 PB - Springer, PP - Singapore : PY - [2018] ID - 824569 KW - Electrical engineering KW - Signal processing KW - Image processing SN - 9789811038129 SN - 9811038120 TI - Innovations in electronics and communication engineering :proceedings of the Fifth ICIECE 2016 / LK - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-981-10-3812-9 UR - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-981-10-3812-9 ER -