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000838977 019__ $$a1033604120
000838977 020__ $$a9783319778723$$q(electronic book)
000838977 020__ $$a3319778722$$q(electronic book)
000838977 020__ $$z9783319778716
000838977 020__ $$z3319778714
000838977 0247_ $$a10.1007/978-3-319-77872-3$$2doi
000838977 035__ $$aSP(OCoLC)on1034546870
000838977 035__ $$aSP(OCoLC)1034546870$$z(OCoLC)1033604120
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000838977 049__ $$aISEA
000838977 050_4 $$aTJ241$$b.S46 2018eb
000838977 08204 $$a621.381/046$$223
000838977 1001_ $$aSeok, Seonho.$$eauthor.
000838977 24510 $$aAdvanced packaging and manufacturing technology based on adhesion engineering :$$bwafer-level transfer packaging and fabrication techniques using interface energy control method /$$cby Seonho Seok.
000838977 264_1 $$aCham :$$bSpringer International Publishing ,$$c[2018]
000838977 300__ $$a1 online resource (viii, 115 pages) :$$billustrations.
000838977 336__ $$atext$$btxt$$2rdacontent
000838977 337__ $$acomputer$$bc$$2rdamedia
000838977 338__ $$aonline resource$$bcr$$2rdacarrier
000838977 347__ $$atext file$$bPDF$$2rda
000838977 4901_ $$aSpringer Series in Advanced Manufacturing,$$x1860-5168
000838977 504__ $$aIncludes bibliographical references.
000838977 5050_ $$aOverview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. .
000838977 506__ $$aAccess limited to authorized users.
000838977 520__ $$aThis book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
000838977 650_0 $$aEngineering.
000838977 650_0 $$aNanotechnology.
000838977 650_0 $$aManufacturing industries.
000838977 650_0 $$aMachinery.
000838977 650_0 $$aTools.
000838977 650_0 $$aTribology.
000838977 650_0 $$aCorrosion and anti-corrosives.
000838977 650_0 $$aCoatings.
000838977 650_0 $$aMaterials science.
000838977 77608 $$iPrint version:$$aSeok, Seonho.$$tAdvanced packaging and manufacturing technology based on adhesion engineering.$$dCham: Springer International Publishing , [2018]$$z9783319778716$$w(OCoLC)1023546131
000838977 830_0 $$aSpringer series in advanced manufacturing.
000838977 852__ $$bebk
000838977 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-77872-3$$zOnline Access$$91397441.1
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000838977 980__ $$aEBOOK
000838977 980__ $$aBIB
000838977 982__ $$aEbook
000838977 983__ $$aOnline
000838977 994__ $$a92$$bISE