000841654 000__ 06095cam\a2200673\i\4500 000841654 001__ 841654 000841654 005__ 20210515151938.0 000841654 006__ m\\\\\o\\d\\\\\\\\ 000841654 007__ cr\cn\nnnunnun 000841654 008__ 150124s2015\\\\nyua\\\foab\\\001\0\eng\d 000841654 020__ $$a9781606505137$$q(electronic book) 000841654 020__ $$z9781606505120$$qprint 000841654 0247_ $$z10.5643/9781606504871$$2doi 000841654 035__ $$a(OCoLC)900732839 000841654 035__ $$a(CaBNvSL)swl00404623 000841654 035__ $$a(MiAaPQ)EBC1911666 000841654 035__ $$a(Au-PeEL)EBL1911666 000841654 035__ $$a(CaPaEBR)ebr11007948 000841654 035__ $$a(CaONFJC)MIL688595 000841654 035__ $$a(OCoLC)900898190 000841654 040__ $$aMiAaPQ$$beng$$erda$$epn$$cMiAaPQ$$dMiAaPQ 000841654 050_4 $$aTK7874.75$$b.G646 2015 000841654 0820_ $$a621.395$$223 000841654 1001_ $$aGoel, Ashok K.,$$d1953-,$$eauthor. 000841654 24512 $$aA one-semester course in modeling of VLSI interconnections /$$cAshok K. Goel. 000841654 264_1 $$aNew York, [New York] (222 East 46th Street, New York, NY 10017) :$$bMomentum Press,$$c2015. 000841654 300__ $$a1 online resource (xv, 340 pages) :$$billustrations. 000841654 336__ $$atext$$2rdacontent 000841654 337__ $$acomputer$$2rdamedia 000841654 338__ $$aonline resource$$2rdacarrier 000841654 4901_ $$aElectronic circuits and semiconductor devices collection,$$x2376-4848 000841654 504__ $$aIncludes bibliographical references and index. 000841654 5050_ $$a1. Introductory concepts -- 1.1 Metallic interconnections -- 1.2 Simplified modeling of resistive interconnections as ladder networks -- 1.3 Propagation modes in a metallic interconnection -- 1.4 Slow-wave mode -- 1.5 Propagation delays -- 000841654 5058_ $$a2. Modeling of interconnection resistances, capacitances, and inductances -- 2.1 Interconnection resistance -- 2.2 Modeling of resistance for a copper interconnection -- 2.3 Interconnection capacitances -- 2.4 The Green's function method, Method of images -- 2.5 Green's function method, Fourier integral approach -- 2.6 Interconnection inductances -- 2.7 Inductance extraction using FastHenry -- 2.8 Approximate equations for capacitances -- 2.9 Approximate equations for interconnection capacitances and inductances on silicon and GaAs substrates -- 000841654 5058_ $$a3. Modeling of interconnection delays -- 3.1 Metal-insulator-semiconductor microstrip line model of an interconnection -- 3.2 Transmission line analysis of single-level interconnections -- 3.3 Transmission line model for multilevel interconnections -- 3.4 Modeling of parallel and crossing interconnections -- 3.5 Modeling of very-high-frequency losses in interconnections -- 3.6 Compact modeling of interconnection delays -- 3.7 Modeling of active interconnections -- 000841654 5058_ $$a4. Modeling of interconnection crosstalk -- 4.1 Lumped capacitance model -- 4.2 Coupled multiconductor MIS microstrip line model -- 4.3 Frequency-domain model analysis of single-level interconnections -- 4.4 Transmission line analysis of parallel multilevel interconnections -- 4.5 Compact expressions for crosstalk analysis -- 000841654 5058_ $$a5. Modeling of electromigration-induced interconnection failure -- 5.1 Electromigration factors and mechanism -- 5.2 Problems caused by electromigration -- 5.3 Reduction of electromigration -- 5.4 Measurement of electromigration -- 5.5 Electromigration in the copper interconnections -- 5.6 Models of integrated circuit reliability -- 5.7 Modeling of electromigration due to current pulses -- 5.8 Guidelines for testing electromigration -- 000841654 5058_ $$a6. Other interconnection technologies -- 6.1 Optical interconnections -- 6.2 Superconducting interconnections -- 6.3 Nanotechnology circuit interconnections -- 000841654 5058_ $$aAppendixes -- A. Tables of constants -- B. Method of images -- C. Method of moments -- D. Transmission line equations -- E. Miller's theorem -- F. Inverse Laplace transformation technique -- Index. 000841654 506__ $$aAccess limited to authorized users. 000841654 5203_ $$aQuantitative understanding of the parasitic capacitances and inductances and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. It is because more than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. An overview of the future interconnection technologies for the nanotechnology circuits will also be presented. This book will be the first book of its kind written for a one-semester course on the mathematical modeling of metallic interconnections on a VLSI circuit. In most institutions around the world offering BS, MS, and Ph.D. degrees in Electrical and Computer Engineering, such a course will be suitable for the first-year graduate students and it will also be appropriate as an elective course for senior level BS students. This book will also be of interest to practicing engineers in the field who are looking for a quick refresher on this subject. 000841654 588__ $$aTitle from PDF title page (viewed on January 24, 2015). 000841654 650_0 $$aIntegrated circuits$$xVery large scale integration$$xMathematical models. 000841654 653__ $$aVLSI 000841654 653__ $$aIntegrated Circuits 000841654 653__ $$aInterconnections 000841654 653__ $$aCopper Interconnections 000841654 653__ $$aPropagation Delays 000841654 653__ $$aCrosstalk 000841654 653__ $$aModeling 000841654 653__ $$aElectromigration 000841654 653__ $$aCapacitances 000841654 653__ $$aInductances 000841654 653__ $$aNanotechnology 000841654 77608 $$iPrint version:$$z9781606505120 000841654 830_0 $$aElectronic circuits and semiconductor devices collection.$$x2376-4848 000841654 852__ $$bebk 000841654 85640 $$3ProQuest Ebook Central Academic Complete$$uhttps://univsouthin.idm.oclc.org/login?url=https://ebookcentral.proquest.com/lib/usiricelib-ebooks/detail.action?docID=1911666$$zOnline Access 000841654 909CO $$ooai:library.usi.edu:841654$$pGLOBAL_SET 000841654 980__ $$aEBOOK 000841654 980__ $$aBIB 000841654 982__ $$aEbook 000841654 983__ $$aOnline