TY  - GEN
AB  - This book presents a comprehensive overview of nanoscale electronics and systems packaging, covering nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. It is intended for industrial and academic researchers, and industrial electronics packaging engineers.
AU  - Morris, James E.,
CN  - TK7870.15
DO  - 10.1007/978-3-319-90362-0
DO  - doi
ET  - Second edition.
ID  - 856291
KW  - Electronic packaging.
KW  - Nanotechnology.
LK  - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-90362-0
N2  - This book presents a comprehensive overview of nanoscale electronics and systems packaging, covering nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. It is intended for industrial and academic researchers, and industrial electronics packaging engineers.
SN  - 9783319903620
SN  - 3319903624
T1  - Nanopackaging :nanotechnologies and electronics packaging /
TI  - Nanopackaging :nanotechnologies and electronics packaging /
UR  - https://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-90362-0
ER  -