000856291 000__ 04997cam\a2200529Ii\4500
000856291 001__ 856291
000856291 005__ 20230306145127.0
000856291 006__ m\\\\\o\\d\\\\\\\\
000856291 007__ cr\un\nnnunnun
000856291 008__ 180925s2018\\\\sz\\\\\\o\\\\\000\0\eng\d
000856291 019__ $$a1054834342$$a1060595049
000856291 020__ $$a9783319903620$$q(electronic book)
000856291 020__ $$a3319903624$$q(electronic book)
000856291 020__ $$z9783319903613
000856291 020__ $$z3319903616
000856291 0247_ $$a10.1007/978-3-319-90362-0$$2doi
000856291 035__ $$aSP(OCoLC)on1054129025
000856291 035__ $$aSP(OCoLC)1054129025$$z(OCoLC)1054834342$$z(OCoLC)1060595049
000856291 040__ $$aN$T$$beng$$erda$$epn$$cN$T$$dN$T$$dGW5XE$$dEBLCP$$dUPM$$dOCLCF$$dOCLCQ$$dYDX$$dUKMGB
000856291 049__ $$aISEA
000856291 050_4 $$aTK7870.15
000856291 08204 $$a621.381046$$223
000856291 24500 $$aNanopackaging :$$bnanotechnologies and electronics packaging /$$cJames E. Morris, editor.
000856291 250__ $$aSecond edition.
000856291 264_1 $$aCham, Switzerland :$$bSpringer,$$c2018.
000856291 300__ $$a1 online resource
000856291 336__ $$atext$$btxt$$2rdacontent
000856291 337__ $$acomputer$$bc$$2rdamedia
000856291 338__ $$aonline resource$$bcr$$2rdacarrier
000856291 347__ $$atext file$$bPDF$$2rda
000856291 5050_ $$aIntro; Foreword to the First Edition; Foreword to the Second Edition; Preface; Contents; Contributors; Chapter 1: Nanopackaging: Nanotechnologies and Electronics Packaging; 1.1 Introduction; 1.2 Computer Modeling; 1.3 Nanoparticles; 1.3.1 Nanoparticles: Introduction; 1.3.2 Nanoparticles: Fabrication; 1.3.3 Nanoparticles: Embedded Capacitors; 1.3.4 Nanoparticles: Embedded Resistors; 1.3.5 Electrically Conductive Adhesives; 1.3.6 Nanoparticles: Sintered Interconnect; 1.3.7 Nanosolder; 1.3.8 Nanoparticles in Solder; 1.3.9 Nanoparticles: Nanocomposites; 1.4 Carbon Nanotubes (CNTs).
000856291 5058_ $$a1.4.1 CNTs: Fabrication1.4.2 CNTs: Composites; 1.4.3 CNTs: Thermal; 1.4.4 Carbon Nanotubes: Electrical; 1.4.5 Nanowires; 1.5 Graphene; 1.5.1 Graphene: Introduction; 1.5.2 Graphene: Nanocomposites; 1.5.3 Graphene: Thermal; 1.5.4 Graphene: Electrical; 1.6 Nanoscale Structures; 1.7 Nano-interconnects; 1.8 Plasmonic Interconnects; 1.9 Miscellaneous; 1.10 EHS: Environment, Health, and Safety; 1.11 Conclusion; References; Chapter 2: Modelling Technologies and Applications; 2.1 Introduction; 2.2 Modelling Technologies; 2.2.1 Continuum Modelling; 2.2.2 Atomistic and Multi-scale Modelling.
000856291 5058_ $$a2.2.3 Optimisation and Uncertainty2.2.4 Future Challenges for Modelling Tools; 2.3 Modelling Applied to Fabrication Processes; 2.3.1 Modelling of Focussed Ion Beam Milling Process; 2.3.2 Modelling of Nanoimprint Lithography (NIL) Process; 2.3.3 Modelling of Electroforming Processes; 2.3.4 Modelling of Additive Manufacturing Processes; 2.4 Modelling Applied to Assembly Processes; 2.4.1 Solder Paste Printing; 2.4.2 Molecular Dynamics Calculation of Solder Reflow Process; 2.4.3 Microwave Heating in Microelectronics and Nano-packaging Applications; 2.5 Modelling Applied to Reliability Predictions.
000856291 5058_ $$a2.5.1 The Effects of Underfills on Solder Joint Reliability2.5.2 Modelling of Anisotropic Conductive Films (ACFs); 2.5.3 Metal Migration-Related Damages in Nano-packaging; 2.5.4 Thermal Interface Materials; 2.6 Conclusions; References; Chapter 3: Advances in Delamination Modeling of Metal/Polymer Systems: Continuum Aspects; 3.1 Introduction; 3.1.1 Delamination-Related Failures in Micro- and Nano-electronics; 3.1.2 Metal-Polymer Adhesion: A Multi-scale Phenomenon; 3.1.3 On the Meaning of the Experimentally Measured Interface Fracture Toughness; 3.1.4 Scope of the Chapter.
000856291 5058_ $$a3.2 Interface Fracture Mechanics3.3 Buckling-Driven Delamination in Flexible Displays; 3.3.1 Experiments; 3.3.2 Numerical Analysis; 3.4 Multi-scale Mechanics of High Toughness Fibrillating Interfaces in Stretchable Electronics; 3.4.1 Experimental Analysis; 3.4.2 Numerical Analysis; 3.5 Competition Between Adhesive and Cohesive Failure at Patterned Surfaces; 3.5.1 Experimental Results; 3.5.2 Numerical Results; 3.6 Integrated Digital Image Correlation (IDIC) for Small-Scale Characterization of Adhesion Properties; 3.6.1 The Integrated Digital Image Correlation Technique.
000856291 506__ $$aAccess limited to authorized users.
000856291 520__ $$aThis book presents a comprehensive overview of nanoscale electronics and systems packaging, covering nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. It is intended for industrial and academic researchers, and industrial electronics packaging engineers.
000856291 588__ $$aOnline resource; title from PDF title page (viewed September 26, 2018).
000856291 650_0 $$aElectronic packaging.
000856291 650_0 $$aNanotechnology.
000856291 7001_ $$aMorris, James E.,$$d1944-$$eeditor.
000856291 77608 $$iPrint version: $$z9783319903613
000856291 77608 $$iPrint version: $$z9783319903637
000856291 852__ $$bebk
000856291 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-319-90362-0$$zOnline Access$$91397441.1
000856291 909CO $$ooai:library.usi.edu:856291$$pGLOBAL_SET
000856291 980__ $$aEBOOK
000856291 980__ $$aBIB
000856291 982__ $$aEbook
000856291 983__ $$aOnline
000856291 994__ $$a92$$bISE