Die-Attach Materials for High Temperature Applications in Microelectronics Packaging : Materials, Processes, Equipment, and Reliability / Kim S. Siow, editor.
2019
TK7870.15
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Linked e-resources
Linked Resource
Concurrent users
Unlimited
Authorized users
Authorized users
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Can lend chapters, not whole ebooks
Details
Title
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging : Materials, Processes, Equipment, and Reliability / Kim S. Siow, editor.
ISBN
9783319992563 (electronic book)
3319992562 (electronic book)
9783319992556
3319992562 (electronic book)
9783319992556
Published
Cham, Switzerland : Springer, [2019]
Language
English
Description
1 online resource.
Call Number
TK7870.15
Dewey Decimal Classification
621.381046
Bibliography, etc. Note
Includes bibliographical references and index.
Access Note
Access limited to authorized users.
Source of Description
Online resource; title from PDF title page (viewed February 4, 2019).
Added Author
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