000866416 000__ 04742cam\a2200517Ii\4500 000866416 001__ 866416 000866416 005__ 20230306145710.0 000866416 006__ m\\\\\o\\d\\\\\\\\ 000866416 007__ cr\cn\nnnunnun 000866416 008__ 190330s2019\\\\sz\\\\\\ob\\\\000\0\eng\d 000866416 019__ $$a1090800289$$a1091048468 000866416 020__ $$a9783030146900$$q(electronic book) 000866416 020__ $$a3030146901$$q(electronic book) 000866416 020__ $$z3030146898 000866416 020__ $$z9783030146894 000866416 035__ $$aSP(OCoLC)on1090914709 000866416 035__ $$aSP(OCoLC)1090914709$$z(OCoLC)1090800289$$z(OCoLC)1091048468 000866416 040__ $$aYDX$$beng$$erda$$cYDX$$dN$T$$dGW5XE$$dEBLCP$$dYDXIT 000866416 049__ $$aISEA 000866416 050_4 $$aTK5103.4835$$b.B69 2019 000866416 08204 $$a621.384$$223 000866416 1001_ $$aBožanić, Mladen,$$d1982-$$eauthor. 000866416 24510 $$aSystems-level packaging for millimeter-wave transceivers /$$cMladen Božanić, Saurabh Sinha. 000866416 264_1 $$aCham, Switzerland :$$bSpringer,$$c[2019] 000866416 300__ $$a1 online resource 000866416 336__ $$atext$$btxt$$2rdacontent 000866416 337__ $$acomputer$$bc$$2rdamedia 000866416 338__ $$aonline resource$$bcr$$2rdacarrier 000866416 4901_ $$aSmart sensors, measurement and instrumentation ;$$vvolume 34 000866416 504__ $$aIncludes bibliographical references. 000866416 5050_ $$aIntro; Preface; Contents; About the Authors; 1 Research Impact of System-Level Packaging for Millimeter-Wave Transceivers; 1.1 Significance of Device Packaging at Millimeter-Wave Range and Systems Approach; 1.2 Research Contextualization: A Modern Communication System; 1.2.1 Transmitter; 1.2.2 Transmitting and Receiving Antennas; 1.2.3 The Receiver; 1.2.4 Example of State-of-the-Art Transceiver; 1.3 Other Considerations: Substrates, Active Devices and Passives; 1.4 Practical Research Focus: Applications of Millimeter-Wave Systems 000866416 5058_ $$a1.5 Identifying Research Gaps: Packaging Techniques and Technologies1.5.1 Traditional Approach-A One-Chip Solution; 1.5.2 A Two-Chip Solution; 1.5.3 Packaging Multiple Dice; 1.5.4 The Ultimate Goal: System Optimization Through Improved Packaging; 1.5.5 The Packaging Decision; 1.6 Research Questions: Packaging for Millimeter-Wave Applications; 1.7 Contribution to the Body of Knowledge; 1.8 Content Overview; References; 2 Millimeter-Wave Research Challenges; 2.1 Wavelength Significance; 2.2 The Millimeter-Wave Part of the Spectrum; 2.3 Propagation of Millimeter Waves 000866416 5058_ $$a2.4 Antennas for Millimeter-Waves2.4.1 General Antenna Theory; 2.4.2 Millimeter-Wave Antennas; 2.5 Millimeter-Wave Considerations; 2.5.1 Losses; 2.5.2 Uncertainty; 2.5.3 Feasibility of Component Values; 2.5.4 Interconnects and Component Sizing; 2.5.5 Coupling and Shielding; 2.5.6 Layout Dependency; 2.5.7 Bonding; 2.5.8 Package Leads; 2.5.9 Concluding Remarks; References; 3 Behavior of Active and Passive Devices at Millimeter-Wave Frequencies; 3.1 Solid-State Active Devices; 3.1.1 Metal-Oxide Transistors; 3.1.2 MOSFET Operation at Millimeter Wave Frequencies; 3.1.3 Bipolar Transistors 000866416 5058_ $$a3.1.4 HBT Operation at Millimeter Wave Frequencies3.1.5 Noise Figure in HBTs and MOSFETs; 3.2 Transmission Lines; 3.2.1 Q-Factors of Passive Devices; 3.2.2 Introduction to Transmission Lines; 3.2.3 Types of Transmission Lines; 3.2.4 General Transmission Line; 3.2.5 The Quarter-Wave Transformer; 3.2.6 Substrate Integrated Waveguides; 3.2.7 Slow Co-planar Waveguides; 3.3 Resistors; 3.4 Capacitors; 3.4.1 Parallel-Plate Capacitors; 3.4.2 Transmission-Line Capacitors; 3.4.3 Other Capacitors; 3.5 Inductors; 3.5.1 Wound Inductors; 3.5.2 Integrated Inductors; 3.5.3 Embedded Inductors 000866416 5058_ $$a3.5.4 Bond Wires3.5.5 Transmission-Line Inductors; 3.5.6 RF Chokes; 3.6 Transformers and Baluns; 3.7 Concluding Remarks; References; 4 Integrated Substrates: Millimeter-Wave Transistor Technologies; 4.1 Means for Comparison of Technologies; 4.2 CMOS Technology; 4.2.1 Important Characteristics; 4.2.2 State-of-the-Art CMOS Technologies; 4.3 High-Electron Mobility Transistor Technology; 4.3.1 Important Characteristics; 4.3.2 State-of-the-Art High-Electron Mobility Technologies; 4.4 Heterojunction Bipolar Transistor Technology; 4.4.1 Important Characteristics 000866416 506__ $$aAccess limited to authorized users. 000866416 588__ $$aDescription based on online resource; title from digital title page (viewed on April 11, 2019). 000866416 650_0 $$aMillimeter wave communication systems. 000866416 650_0 $$aGigabit communications$$xEquipment and supplies. 000866416 7001_ $$aSinha, Saurabh,$$eauthor. 000866416 77608 $$iPrint version: $$z3030146898$$z9783030146894$$w(OCoLC)1084390544 000866416 830_0 $$aSmart sensors, measurement and instrumentation ;$$v34. 000866416 852__ $$bebk 000866416 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-030-14690-0$$zOnline Access$$91397441.1 000866416 909CO $$ooai:library.usi.edu:866416$$pGLOBAL_SET 000866416 980__ $$aEBOOK 000866416 980__ $$aBIB 000866416 982__ $$aEbook 000866416 983__ $$aOnline 000866416 994__ $$a92$$bISE