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Intro; Supervisor's Foreword; Abstract; Acknowledgements; Contents; Abbreviations; 1 Introduction; 1.1 Outline; References; 2 Properties of Two-Dimensional Materials; 2.1 Introduction; 2.2 Electronic bandstructures; 2.2.1 Graphene Tight Binding; 2.2.2 hBN bandstructure; 2.3 Mechanical Properties; 2.4 Capacitance and Field Effect; 2.5 Closing Remarks; References; 3 van der Waals Heterostructures; 3.1 Introduction; 3.2 van der Waals Forces; 3.3 Graphene on Hexagonal Boron Nitride-A Short History; 3.3.1 Moiré Superlattice; 3.3.2 Electronic Characteristics; 3.3.3 Mechanical Characteristics
3.4 Intentions of This ThesisReferences; 4 Fabrication and Characterisation Techniques; 4.1 Introduction; 4.2 Fabrication Techniques; 4.2.1 Flake Preparation, Selection and Alignment; 4.2.2 Lithography; 4.2.3 Etching Techniques; 4.2.4 Metal Deposition, Lift-Off and Bonding; 4.3 Characterisation Techniques; 4.3.1 Electron Transport; 4.3.2 Raman Spectroscopy; 4.3.3 Scanning Electron Microscopy; 4.3.4 Atomic Force Microscopy; 4.3.5 Scanning Tunnelling Microscopy/Spectroscopy; 4.4 Closing Remarks; References; 5 Studying Superlattice Kinks via Electronic Transport; 5.1 Introduction
5.2 Concept and Design5.3 Device Fabrication; 5.4 Initial Characterisation; 5.5 Redesigned Devices; 5.5.1 Measurement Process and Results; 5.6 Discussion; 5.6.1 Future Work; 5.7 Conclusions; References; 6 Atomic Force Microscopy Studiespg of Superlattice Kinks; 6.1 Introduction; 6.2 Concept, Design and Fabrication; 6.3 Initial Device Characterisation and Measurement Process; 6.3.1 Measurement Process; 6.4 Results; 6.5 Discussion; 6.5.1 Drift; 6.6 Conclusions; References; 7 Additional Work; 7.1 Introduction; 7.2 Scanning Tunnelling Microscopy; 7.3 Umklapp Devices
7.4 Molybdenum Ditelluride (MoTe2)References; 8 Conclusions and Future Work; A Thermal Drift and Additional Resultspg for Chap. [ThermalExpansionCoefficientDevices]6
3.4 Intentions of This ThesisReferences; 4 Fabrication and Characterisation Techniques; 4.1 Introduction; 4.2 Fabrication Techniques; 4.2.1 Flake Preparation, Selection and Alignment; 4.2.2 Lithography; 4.2.3 Etching Techniques; 4.2.4 Metal Deposition, Lift-Off and Bonding; 4.3 Characterisation Techniques; 4.3.1 Electron Transport; 4.3.2 Raman Spectroscopy; 4.3.3 Scanning Electron Microscopy; 4.3.4 Atomic Force Microscopy; 4.3.5 Scanning Tunnelling Microscopy/Spectroscopy; 4.4 Closing Remarks; References; 5 Studying Superlattice Kinks via Electronic Transport; 5.1 Introduction
5.2 Concept and Design5.3 Device Fabrication; 5.4 Initial Characterisation; 5.5 Redesigned Devices; 5.5.1 Measurement Process and Results; 5.6 Discussion; 5.6.1 Future Work; 5.7 Conclusions; References; 6 Atomic Force Microscopy Studiespg of Superlattice Kinks; 6.1 Introduction; 6.2 Concept, Design and Fabrication; 6.3 Initial Device Characterisation and Measurement Process; 6.3.1 Measurement Process; 6.4 Results; 6.5 Discussion; 6.5.1 Drift; 6.6 Conclusions; References; 7 Additional Work; 7.1 Introduction; 7.2 Scanning Tunnelling Microscopy; 7.3 Umklapp Devices
7.4 Molybdenum Ditelluride (MoTe2)References; 8 Conclusions and Future Work; A Thermal Drift and Additional Resultspg for Chap. [ThermalExpansionCoefficientDevices]6