000890484 000__ 04605cam\a2200505Ia\4500
000890484 001__ 890484
000890484 005__ 20230306150105.0
000890484 006__ m\\\\\o\\d\\\\\\\\
000890484 007__ cr\un\nnnunnun
000890484 008__ 190518s2019\\\\si\\\\\\ob\\\\000\0\eng\d
000890484 019__ $$a1101270530$$a1105193432
000890484 020__ $$a9789811380518$$q(electronic book)
000890484 020__ $$a9811380511$$q(electronic book)
000890484 020__ $$z9811380503
000890484 020__ $$z9789811380501
000890484 0247_ $$a10.1007/978-981-13-8
000890484 035__ $$aSP(OCoLC)on1101798403
000890484 035__ $$aSP(OCoLC)1101798403$$z(OCoLC)1101270530$$z(OCoLC)1105193432
000890484 040__ $$aEBLCP$$beng$$cEBLCP$$dYDX$$dGW5XE$$dYDXIT$$dLQU
000890484 049__ $$aISEA
000890484 050_4 $$aTK7874.78$$b.K37 2019
000890484 08204 $$a621.38412$$223
000890484 08204 $$a621.39/5$$223
000890484 1001_ $$aKarmakar, Ayan.
000890484 24510 $$aSi-RF technology /$$cAyan Karmakar, Kamaljeet Singh.
000890484 264_1 $$aSingapore :$$bSpringer,$$c[2019]
000890484 300__ $$a1 online resource (157 pages)
000890484 336__ $$atext$$btxt$$2rdacontent
000890484 337__ $$acomputer$$bc$$2rdamedia
000890484 338__ $$aonline resource$$bcr$$2rdacarrier
000890484 5050_ $$aIntro; Foreword; Preface; Acknowledgements; Contents; About the Authors; Abbreviations; 1 Silicon Implementation of Planar Topologies; 1.1 Microstrip and CPW Topologies; 1.2 Losses in Planar Topologies; 1.3 Substrate Selection; 1.4 Silicon Substrate and Associated Challenges; 1.5 Modeling Aspects; 1.6 Loss Compensation Techniques; 1.7 Summarization; References; 2 Fabrication Technologies; 2.1 Bulk and Surface Micromachining; 2.2 Wafer Bonding; 2.2.1 Anodic Bonding; 2.2.2 Eutectic Bonding; 2.3 Summarization; References; 3 Passive Circuits; 3.1 Planar Balun (Single-Band Topology)
000890484 5058_ $$a3.1.1 Design Aspects3.1.2 Electromagnetic Analysis and Layout; 3.1.3 Effect of Substrate Resistivity; 3.1.4 Fabrication and Measured Results; 3.2 Power Divider (Multiband Topologies); 3.2.1 Dual-Band Power Divider; 3.2.2 Receiver Concept (Multiband Topology); 3.3 CPW-Microstrip Transition; 3.4 Summarization; References; 4 Planar Antenna; 4.1 Ultra-Wideband Topology; 4.1.1 Antenna Design; 4.1.2 Fabrication and Measured Results; 4.1.3 Time-Domain Analysis of the Proposed Monopole Antenna; 4.2 Micromachined Patch Antenna and Array Topology; 4.2.1 Antenna Design
000890484 5058_ $$a4.2.2 Fabrication and Measured Results4.3 Summary; 4.4 MATLAB Program for Calculations of Patch Length and Width with Given Dimensions; References; 5 MEMS Switch; 5.1 Background; 5.2 RF-Switch Development; 5.2.1 Electrical Modeling; 5.2.2 Fabrication Process; 5.2.3 Test and Characterization; 5.3 Switched-Line Phase Shifter; 5.3.1 Bit Design; 5.3.2 CLR Model of Single-Bit Phase Shifter; 5.3.3 EM Simulation of the Individual Bit; 5.3.4 Fabricated Prototype; 5.3.5 Proposed Testing Methodology of Phase Shifter; 5.4 MATLAB Program; 5.5 Summary; References; 6 Packaging Concept in Radio Frequency
000890484 5058_ $$a6.1 Standard RF Package Configuration6.2 Package Simulation; 6.2.1 Eigen-Mode Simulation; 6.2.2 Loss Characterization; 6.3 Proposed Modification; 6.4 Characterization; 6.5 Through-Silicon Via (TSV); 6.5.1 Modeling; 6.5.2 Process Establishment; 6.6 MATLAB Code; 6.7 Summary; References; Future Scope; Appendix A; Material Properties of Some Useful Metals and Dielectrics; Appendix B; Relaxation Time Estimation for Some Materials Used in RF/Microwave Applications; Appendix C; Tentative Etch Rate of Various Thin Films of in Wet and Dry Methods; Appendix D
000890484 5058_ $$aReadymade Chart for VSWR, Return Loss, and Reflection CoefficientAppendix E; Frequently used Equipments and Test Components in RF Domain
000890484 506__ $$aAccess limited to authorized users.
000890484 520__ $$aThis book discusses the recent research developments of various passive microwave circuits on silicon substrate and demonstrated operations catering for multiple frequency bands. It covers the design, modelling, process fabrication and characterization aspects with practical examples. The book will be of use to researchers and engineers working in the field of RF or microwave engineering, who can use the techniques and approaches effectively without having to refer to multiple sources.
000890484 588__ $$aDescription based on online resource; title from digital title page (viewed on June 13, 2019).
000890484 650_0 $$aRadio frequency integrated circuits.
000890484 7001_ $$aSingh, Kamaljeet.
000890484 77608 $$iPrint version:$$aKarmakar, Ayan$$tSi-RF Technology$$dSingapore : Springer,c2019$$z9789811380501
000890484 852__ $$bebk
000890484 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-981-13-8051-8$$zOnline Access$$91397441.1
000890484 909CO $$ooai:library.usi.edu:890484$$pGLOBAL_SET
000890484 980__ $$aEBOOK
000890484 980__ $$aBIB
000890484 982__ $$aEbook
000890484 983__ $$aOnline
000890484 994__ $$a92$$bISE