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000922526 019__ $$a1121274933
000922526 020__ $$a9783030252014$$q(electronic book)
000922526 020__ $$a3030252019$$q(electronic book)
000922526 0248_ $$a10.1007/978-3-030-25
000922526 035__ $$aSP(OCoLC)on1117642346
000922526 035__ $$aSP(OCoLC)1117642346$$z(OCoLC)1121274933
000922526 040__ $$aEBLCP$$beng$$epn$$cEBLCP$$dGW5XE$$dLQU$$dOCLCF$$dOCLCQ$$dUKMGB
000922526 049__ $$aISEA
000922526 050_4 $$aTA418.54
000922526 08204 $$a620.11296$$223
000922526 1001_ $$aChen, Zengtao.
000922526 24510 $$aAdvanced thermal stress analysis of smart materials and structures /$$cZengtao Chen, Abdolhamid Akbarzadeh.
000922526 260__ $$aCham :$$bSpringer,$$c2020.
000922526 300__ $$a1 online resource (313 pages)
000922526 336__ $$atext$$btxt$$2rdacontent
000922526 337__ $$acomputer$$bc$$2rdamedia
000922526 338__ $$aonline resource$$bcr$$2rdacarrier
000922526 4901_ $$aStructural integrity,$$x2522-5618 ;$$vv. 10
000922526 504__ $$aIncludes bibliographical references.
000922526 506__ $$aAccess limited to authorized users.
000922526 520__ $$aThis is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.
000922526 588__ $$aDescription based on print version record.
000922526 650_0 $$aSmart materials.
000922526 650_0 $$aSmart structures.
000922526 650_0 $$aThermal stresses.
000922526 650_0 $$aMaterials$$xThermal conductivity.
000922526 7001_ $$aAkbarzadeh, Abdolhamid.
000922526 77608 $$iPrint version:$$aChen, Zengtao.$$tAdvanced Thermal Stress Analysis of Smart Materials and Structures.$$dCham : Springer, ©2019$$z9783030252007
000922526 830_0 $$aStructural integrity ;$$vv. 10.
000922526 852__ $$bebk
000922526 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-3-030-25201-4$$zOnline Access$$91397441.1
000922526 909CO $$ooai:library.usi.edu:922526$$pGLOBAL_SET
000922526 980__ $$aEBOOK
000922526 980__ $$aBIB
000922526 982__ $$aEbook
000922526 983__ $$aOnline
000922526 994__ $$a92$$bISE