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000933141 001__ 933141
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000933141 008__ 200604s2020\\\\si\\\\\\ob\\\\001\0\eng\d
000933141 019__ $$a1157083556
000933141 020__ $$a9789811539206$$q(electronic book)
000933141 020__ $$a9811539200$$q(electronic book)
000933141 020__ $$z9811539197
000933141 020__ $$z9789811539190
000933141 035__ $$aSP(OCoLC)on1156352539
000933141 035__ $$aSP(OCoLC)1156352539$$z(OCoLC)1157083556
000933141 040__ $$aYDX$$beng$$cYDX$$dEBLCP$$dGW5XE
000933141 049__ $$aISEA
000933141 050_4 $$aTS610
000933141 08204 $$a671.5/6$$223
000933141 1001_ $$aLau, John H.
000933141 24510 $$aAssembly and reliability of lead-free solder joints /$$cJohn H. Lau, Ning-Cheng Lee.
000933141 260__ $$aSingapore :$$bSpringer,$$c2020.
000933141 300__ $$a1 online resource
000933141 336__ $$atext$$btxt$$2rdacontent
000933141 337__ $$acomputer$$bc$$2rdamedia
000933141 338__ $$aonline resource$$bcr$$2rdacarrier
000933141 504__ $$aIncludes bibliographical references and index.
000933141 506__ $$aAccess limited to authorized users.
000933141 650_0 $$aSolder and soldering.
000933141 650_0 $$aJoints (Engineering)
000933141 7001_ $$aLee, Ning-Cheng.
000933141 77608 $$iPrint version: $$z9811539197$$z9789811539190$$w(OCoLC)1141941056
000933141 852__ $$bebk
000933141 85640 $$3SpringerLink$$uhttps://univsouthin.idm.oclc.org/login?url=http://link.springer.com/10.1007/978-981-15-3920-6$$zOnline Access$$91397441.1
000933141 909CO $$ooai:library.usi.edu:933141$$pGLOBAL_SET
000933141 980__ $$aEBOOK
000933141 980__ $$aBIB
000933141 982__ $$aEbook
000933141 983__ $$aOnline
000933141 994__ $$a92$$bISE