Assembly and reliability of lead-free solder joints / John H. Lau, Ning-Cheng Lee.
2020
TS610
Linked e-resources
Linked Resource
Concurrent users
Unlimited
Authorized users
Authorized users
Document Delivery Supplied
Can lend chapters, not whole ebooks
Details
Title
Assembly and reliability of lead-free solder joints / John H. Lau, Ning-Cheng Lee.
Author
ISBN
9789811539206 (electronic book)
9811539200 (electronic book)
9811539197
9789811539190
9811539200 (electronic book)
9811539197
9789811539190
Publication Details
Singapore : Springer, 2020.
Language
English
Description
1 online resource
Call Number
TS610
Dewey Decimal Classification
671.5/6
Bibliography, etc. Note
Includes bibliographical references and index.
Access Note
Access limited to authorized users.
Added Author
Available in Other Form
Print version: 9789811539190
Linked Resources
Record Appears in