Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser, Ph. D. and Steffen Kröhnert.
2019
TK7874 .A383 2019
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Details
Title
Advances in embedded and fan-out wafer level packaging technologies / edited by Beth Keser, Ph. D. and Steffen Kröhnert.
ISBN
9781119314134
9781119313977 (electronic book)
9781119313977 (electronic book)
Published
Hoboken, NJ : Wiley, 2019.
Language
English
Description
1 online resource (xxvii, 548 pages) : illustrations
Call Number
TK7874 .A383 2019
Dewey Decimal Classification
621.38173
Bibliography, etc. Note
Includes bibliographical references and index.
Access Note
Access limited to authorized users.
Source of Description
Description based on print version record.
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