Recent progress in lead-free solder technology : materials development, processing and performances / Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Azman Jalar, Mohd Izrul Izwan Ramli, editors.
Mohd Arif Anuar Mohd Salleh, editor.; Abdul Aziz, Mohd Sharizal, editor.; Jalar, Azman, editor.; Izwan Ramli, Mohd Izrul, editor.
2022
TS610
Available Online

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Title
Recent progress in lead-free solder technology : materials development, processing and performances / Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Azman Jalar, Mohd Izrul Izwan Ramli, editors.
ISBN
9783030934415 (electronic bk.)
3030934411 (electronic bk.)
9783030934408
3030934403
DOI
https://doi.org/10.1007/978-3-030-93441-5
Published
Cham : Springer, [2022]
Copyright
©2022
Language
English
Description
1 online resource : illustrations (chiefly color).
Item Number
10.1007/978-3-030-93441-5 doi
Call Number
TS610
Dewey Decimal Classification
671.5/6
Summary
This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.
Access Note
Access limited to authorized users.
Source of Description
Online resource; title from PDF title page (SpringerLink, viewed March 11, 2022).
Added Author
Mohd Arif Anuar Mohd Salleh, editor.
Abdul Aziz, Mohd Sharizal, editor.
Jalar, Azman, editor.
Izwan Ramli, Mohd Izrul, editor.
Series
Topics in mining, metallurgy and materials engineering.
Available in Other Form
Print version: 9783030934408
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Record Appears in
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Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder
Development of Geopolymer Ceramic Reinforced Solder
Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders
Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process
Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics
Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste
Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi
The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental
Flux Modification for Wettability and Reliability Improvement in Solder Joints
Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints
Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements
The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth
Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering
Solder Pastes Rheology Data for Stencil Printing Numerical Investigations
Tin Whiskers Growth in Electronic Assemblies.

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