Electronics production defects and analysis / Oommen Tharakan Kuttiyil Thomas, Padma Padmanabhan Gopalan.
Thomas, Oommen Tharakan Kuttiyil, author.; Gopalan, Padma Padmanabhan, author.
2022
TK7870 .T56 2022
Available Online

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Title Electronics production defects and analysis / Oommen Tharakan Kuttiyil Thomas, Padma Padmanabhan Gopalan.
Author Thomas, Oommen Tharakan Kuttiyil, author.
ISBN 9789811698248 (electronic bk.)
9811698244 (electronic bk.)
9789811698231
9811698236
DOI https://doi.org/10.1007/978-981-16-9824-8
Published Singapore : Springer, [2022]
Copyright ©2022
Language English
Description 1 online resource : illustrations (chiefly color).
Other Standard Identifiers 10.1007/978-981-16-9824-8 doi
Call Number TK7870 .T56 2022
Dewey Decimal Classification 621.381
Summary This book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
Bibliography, etc. Note Includes bibliographical references.
Access Note Access limited to authorized users.
Source of Description Online resource; title from PDF title page (SpringerLink, viewed April 13, 2022).
Added Author Gopalan, Padma Padmanabhan, author.
Series Springer tracts in electrical and electronics engineering.
Available in Other Form Print version: 9789811698231
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Chapter 1: Introduction
Chapter 2: Soldering Defects
Chapter 3: PCB Defects
Chapter 4: Mounting Defects
Chapter 5: Conformal Coating and Potting Defects
Chapter 6: EEE Component Defects
Chapter 7: Workmanship Defects
Chapter 8: Defects due to the usage of Non-FFF Components
Chapter 9: Defects in CAD Layout.

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