Polymeric materials for electronic packaging / Shozo Nakamura.
2023
QD382.C66 N35 2023
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Details
Title
Polymeric materials for electronic packaging / Shozo Nakamura.
ISBN
9781394188826
139418882X
9781394188819
1394188811
9781394188802
1394188803
9781394188796
139418882X
9781394188819
1394188811
9781394188802
1394188803
9781394188796
Published
Hoboken, New Jersey : John Wiley & Sons, Inc. ; Piscataway, NJ : IEEE Press, [2023]
Language
English
Description
1 online resource (xiii, 189 pages) : illustrations (some color)
Item Number
10.1002/9781394188826 doi
Call Number
QD382.C66 N35 2023
Dewey Decimal Classification
620.1/9204297
Bibliography, etc. Note
Includes bibliographical references and index.
Access Note
Access limited to authorized users
Reproduction
Electronic reproduction. Ann Arbor, MI Available via World Wide Web.
Source of Description
Description based on online resource; title from digital title page (viewed on October 24, 2023).
Added Corporate Author
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